Toshiba PRO L645 Manual Do Utilizador

 

4.1 Overview....................................................................................................................... 1 

Safety Precautions ................................................................................................... 2 

Before You Begin ................................................................................................... 3 

Disassembly Procedure ........................................................................................... 4 

Assembly Procedure ............................................................................................... 5 

Tools and Equipment .............................................................................................. 5 

Screw Tightening Torque ....................................................................................... 6 

Grip Color ............................................................................................................... 6 

Screw Notation........................................................................................................ 7 

4.2 Battery 

pack .................................................................................................................. 8 

4.3 HDD ............................................................................................................................ 11 

4.4 Memory 

Module ......................................................................................................... 14 

4.5 Keyboard..................................................................................................................... 17 

4.6 

Wireless LAN card and BT Module ........................................................................... 20 

4.7 3G 

Module .................................................................................................................. 23 

4.8 Display 

Assembly ....................................................................................................... 26 

4.9       Top Cover Assembly .................................................................................................. 33 

4.10 Touch 

pad.................................................................................................................... 36 

4.11     I/O board ..................................................................................................................... 39 

4.12    System Board .............................................................................................................. 41 

4.13   CPU Heat Sink ............................................................................................................ 46 

4.14   LCD unit ..................................................................................................................... 48 

4.15   Web Camera Module .................................................................................................. 52 

4.16     Application for Thermal pad and grease on CPU, NB, V-ram and chock…………...55 

4.17     Speaker Box………………………………………………………………………….57 

4.18     ODD Bezel…………………………………………………………………………...60