Intel SERVER CHASSIS SR2500 SR2500 Manual Do Utilizador

Códigos do produto
SR2500
Página de 115
Cooling Subsystem 
Intel® Server System SR2500AL 
 
 
Revision – 1.00 
Intel order number D31980-004 
26 
 
3.3.3 
CPU / Memory / Low Profile PCI Zone 
The CPU / memory / low profile PCI zone is the area between the low profile riser card of the 
riser assembly and the right chassis wall. In a non-redundant fan configuration, the air flow for 
this zone is generated by system fans 1 and 2 of the fan module. In a redundant fan 
configuration, the air flow for this zone is provided by system fans 1, 2, 3 and 4. Air is drawn 
from the drive bay area, through the fans, directed through the CPU air duct, and out through 
ventilation holes on both the back wall and rear side wall of the chassis. 
The CPU air duct is used to direct air flow through the processor heat sinks for both single and 
dual processor configurations. For single processor configurations, a flexible air baffle is 
attached to the air duct as shown in the following diagram. 
AF000048
 
Figure 19. CPU Air Duct with Air Baffle 
Operating a single processor configuration without the air baffle installed will result in the 
processor over heating and may cause the system to shutdown. 
3.4  Drive Bay Population 
To maintain the proper air pressure within the system, all hard drive bays must be populated 
with either a hard drive, or drive blank. 
TP02104
 
Figure 20. Drive Blank