Intel SERVER CHASSIS SR2500 SR2500 Manual Do Utilizador
Códigos do produto
SR2500
Intel® Server System SR2500AL
Supported Intel® Server Boards
Revision – 1.00
Intel order number D31980-004
79
Dual-Core Intel
®
Xeon
®
processors 5000 sequence will encompass the following:
Table 54. Processor Support Matrix
Processor Family
System Bus
Speed
Core Frequency
Cache
Watts
Support
Intel
®
Xeon
®
Processor 533
MHz
All
No
Intel
®
Xeon
®
Processor 800
MHz
All
No
Dual-Core Intel
®
Xeon
®
Processor 5030
667 MHz
2.67 GHz
2x 2 MB
95
Yes
Dual-Core Intel
®
Xeon
®
Processor 5050
667 MHz
3.0 GHz
2x 2 MB
95
Yes
Dual-Core Intel
®
Xeon
®
Processor 5060
1066 MHz
3.2 GHz
2x 2 MB
130
Yes
Dual-Core Intel
®
Xeon
®
Processor 5063
1066 MHz
3.2 GHz
2x 2 MB
95
Yes
Dual-Core Intel
®
Xeon
®
Processor 5080
1066 MHz
3.73 GHz
2x 2 MB
130
Yes
Dual-Core Intel
®
Xeon
®
Processor 51xx
1333/1066 MHz
TBD
TBD
TBD
Yes
9.1.1.1
Processor Population Rules
When two processors are installed, both must be of identical revision, core voltage, and
bus/core speed. When only one processor is installed, it must be in the socket labeled CPU1.
The other socket must be empty.
bus/core speed. When only one processor is installed, it must be in the socket labeled CPU1.
The other socket must be empty.
The system is designed to provide up to 130A of current per processor. Processors with higher
current requirements are not supported.
current requirements are not supported.
No terminator is required in the second processor socket when using a single processor
configuration.
configuration.
9.1.1.2
Common Enabling Kit (CEK) Design Support
The server system complies with Intel’s Common Enabling Kit (CEK) processor mounting and
heat sink retention solution. The server board ships with a CEK spring snapped onto the
underside of the server board, beneath each processor socket. The heat sink attaches to the
CEK, over the top of the processor and the thermal interface material (TIM). See the figure
below for the stacking order of the chassis, CEK spring, server board, TIM, and heat sink.
heat sink retention solution. The server board ships with a CEK spring snapped onto the
underside of the server board, beneath each processor socket. The heat sink attaches to the
CEK, over the top of the processor and the thermal interface material (TIM). See the figure
below for the stacking order of the chassis, CEK spring, server board, TIM, and heat sink.
The CEK spring is removable, allowing for the use of non-Intel heat sink retention solutions.