Texas Instruments TMS320DM355 Manual Do Utilizador
www.ti.com
PRODUCT PREVIEW
7
Mechanical Data
7.1 Thermal Data for ZCE
7.1.1 Packaging Information
TMS320DM355
Digital Media System-on-Chip (DMSoC)
SPRS463A – SEPTEMBER 2007 – REVISED SEPTEMBER 2007
The following table(s) show the thermal resistance characteristics for the PBGA – ZCE mechanical
package.
package.
Note
that
micro-vias
are
not
required.
Contact
your
TI
representative
for
routing
recommendations.
The following table shows the thermal resistance characteristics for the PBGA – ZCE mechanical
package.
package.
Table 7-1. Thermal Resistance Characteristics (PBGA Package) [ZCE]
NO.
μ
C/W
AIR FLOW (m/s)
(1)
1
R
Θ
JC
Junction-to-case
TBD
TBD
2
R
Θ
JB
Junction-to-board
TBD
TBD
3
R
Θ
JA
Junction-to-free air
TBD
TBD
4
Psi
JT
Junction-to-package top
TBD
TBD
5
Psi
JB
Junction-to-board
TBD
TBD
(1)
m/s = meters per second
The following packaging information and reflect the most current data available for the designated device.
This data is subject to change without notice and without revision of this document. Note that micro-vias
are not required for this package.
This data is subject to change without notice and without revision of this document. Note that micro-vias
are not required for this package.
Mechanical Data
153