Intel Xeon E5405 BX80574E5405 Manual Do Utilizador
Códigos do produto
BX80574E5405
Thermal/Mechanical Reference Design
44
Quad-Core Intel® Xeon® Processor 5400 Series TMDG
The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile
specification for the Quad-Core Intel® Xeon® Processor E5400 Series. From
specification for the Quad-Core Intel® Xeon® Processor E5400 Series. From
the three-sigma (mean+3sigma) performance of the thermal solution is computed to
be 0.246 °C/W and the processor local ambient temperature (T
be 0.246 °C/W and the processor local ambient temperature (T
LA
) for this thermal
solution is 40 °C. Hence, the Thermal Profile equation for this thermal solution is
calculated as:
calculated as:
Equation 2-10.y = 0.246*X + 40
where,
y = Processor T
CASE
value (°C)
x = Processor power value (W)
below shows the comparison of this reference thermal solution’s Thermal
Profile to the Quad-Core Intel® Xeon® Processor E5400 Series Thermal Profile
specification. The 1U CEK solution meets the Thermal Profile with 7.3°C margin at the
upper end (TDP). By designing to Quad-Core Intel® Xeon® Processor E5400 Series
Thermal Profile, it is ensured that no measurable performance loss due to TCC
activation is observed under the given environmental conditions.
specification. The 1U CEK solution meets the Thermal Profile with 7.3°C margin at the
upper end (TDP). By designing to Quad-Core Intel® Xeon® Processor E5400 Series
Thermal Profile, it is ensured that no measurable performance loss due to TCC
activation is observed under the given environmental conditions.
Figure 2-20. 1U CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor X5400
Series Thermal Profile B
40
45
50
55
60
65
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
Power (W)
Tem
p
e
ra
tu
re
(
C
)
Thermal Profile B
Y = 0.221 * X + 43.5
1U CEK Reference Solution
Y = 0.246 * X + 40
T
CASE_MAX_B
@ TDP
90
100
110
TDP
120
70