Intel Pentium III BX80525U533512E Ficha De Dados
Códigos do produto
BX80525U533512E
76
Datasheet
S.E.C.C. and S.E.C.C.2 Mechanical Specifications
5.6
Intel
®
Pentium
®
III Processor Core Pad to Substrate Via
Assignments
These test points are the closest locations to the processor core die pad and should be used to
validate processor core timings and signal quality on the back of the S.E.C.C. or the S.E.C.C.2
package. See the SECC Disassembly Process Application Note for the instructions on removing
the cover of the SECC package.
validate processor core timings and signal quality on the back of the S.E.C.C. or the S.E.C.C.2
package. See the SECC Disassembly Process Application Note for the instructions on removing
the cover of the SECC package.
5.6.1
Processor Core Pad Via Assignments (CPUID=067xh)
shows the via locations on the back of the processor substrate.
5.6.2
Processor Core Signal Assignments (CPUID=067xh)
shows the signal to via and the via to signal assignments, respectively.
Figure 48. Processor Core Pad Via Assignments
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