Intel E8190 EU80570PJ0676MN Manual Do Utilizador
Códigos do produto
EU80570PJ0676MN
Processor Thermal/Mechanical Information
Thermal and Mechanical Design Guidelines
19
Figure 2-2. Processor Case Temperature Measurement Location
37.5 mm
Measure T
C
at this point
(geometric center of the package)
37.
5 m
m
37.5 mm
Measure T
C
at this point
(geometric center of the package)
37.
5 m
m
2.2.2
Thermal Profile
The Thermal Profile defines the maximum case temperature as a function of processor
power dissipation. Refer to the datasheet for the further information.
power dissipation. Refer to the datasheet for the further information.
2.2.3
Thermal Solution Design Requirements
While the thermal profile provides flexibility for ATX /BTX thermal design based on its
intended target thermal environment, thermal solutions that are intended to function
in a multitude of systems and environments need to be designed for the worst-case
thermal environment. The majority of ATX /BTX platforms are targeted to function in
an environment that will have up to a 35° C ambient temperature external to the
system.
intended target thermal environment, thermal solutions that are intended to function
in a multitude of systems and environments need to be designed for the worst-case
thermal environment. The majority of ATX /BTX platforms are targeted to function in
an environment that will have up to a 35° C ambient temperature external to the
system.
For ATX platforms, an active air-cooled design, assumed be used in ATX Chassis, with
a fan installed at the top of the heatsink equivalent to the reference design (see
Chapter 6) should be designed to manage the processor TDP at an inlet temperature
of 35° C + 5°C = 40° C.
a fan installed at the top of the heatsink equivalent to the reference design (see
Chapter 6) should be designed to manage the processor TDP at an inlet temperature
of 35° C + 5°C = 40° C.
For BTX platforms, a front-to-back cooling design equivalent to Intel BTX TMA Type II
reference design (see the Chapter 5) should be designed to manage the processor
TDP at an inlet temperature of 35° C + 0.5° C = 35.5° C.
reference design (see the Chapter 5) should be designed to manage the processor
TDP at an inlet temperature of 35° C + 0.5° C = 35.5° C.
The slope of the thermal profile was established assuming a generational improvement
in thermal solution performance of the Intel reference design. For an example of Intel
Core™2 Duo Processor E8000 series with 6 MB in ATX platform, its improvement is
about 15% over the Intel reference design (E18764-001). This performance is
expressed as the slope on the thermal profile and can be thought of as the thermal
in thermal solution performance of the Intel reference design. For an example of Intel
Core™2 Duo Processor E8000 series with 6 MB in ATX platform, its improvement is
about 15% over the Intel reference design (E18764-001). This performance is
expressed as the slope on the thermal profile and can be thought of as the thermal
resistance of the heatsink attached to the processor,
Ψ
CA
(Refer to Section 3.1). The
intercept on the thermal profile assumes a maximum ambient operating condition that
is consistent with the available chassis solutions.
is consistent with the available chassis solutions.