Intel 2 Extreme X7900 LF80537GG0724M Manual Do Utilizador

Códigos do produto
LF80537GG0724M
Página de 87
Thermal Specifications and Design Considerations
80
Datasheet
NOTES:
1.
The TDP specification should be used to design the processor thermal solution. The TDP is not the 
maximum theoretical power the processor can generate. 
2.
Not 100% tested. These power specifications are determined by characterization of the processor currents 
at higher temperatures and extrapolating the values for the temperature indicated.
3.
As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal Monitor’s automatic 
mode is used to indicate that the maximum T
J
 has been reached. Refer to 
 for more details.
4.
The Intel Thermal Monitor automatic mode must be enabled for the processor to operate within 
specifications.
5.
Intel Dynamic Acceleration mode is not supported.
6.
At Tj of 100°C.
7.
At Tj of 50
o
C.
8.
At Tj of 35°C.
9.
4-M L2 cache.
5.1
Thermal Specifications
The processor incorporates three methods of monitoring die temperature: 
• Thermal  Diode
• Intel Thermal Monitor 
• Digital Thermal Sensor
Table 22.
Power Specifications for the Intel Core 2 Extreme Processor
Symbol
Processor 
Number
Core Frequency & Voltage
Thermal Design 
Power
Unit
Notes
TDP
X7900
X7800
2.8 GHz & HFM V
CC
2.6 GHz & HFM V
CC
1.2 GHZ & LFM V
CC
0.80 GHZ & SuperLFM V
CC
c
44
44
35
27
W
1, 4, 5, 6, 9
Symbol
Parameter
Min
Typ
Max
Unit
P
AH,
P
SGNT
Auto Halt, Stop Grant Power
at HFM V
CC
at SuperLFM V
CC
15.7
9.3
W
2,  5,  7
P
SLP
Sleep Power 
at HFM V
CC
at SuperLFM V
CC
15.0
9.1
W
2,  5,  7
P
DSLP
Deep Sleep Power 
at HFM V
CC
at SuperLFM V
CC
9.5
6.0
W
2,  5,  8
P
DPRSLP
Deeper Sleep Power
3.0
W
2, 8
P
DC4
Intel Enhanced Deeper Sleep Power
2.5
W
2, 8
T
J
Junction Temperature
0
100
°C
3,  4