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Intel 2 Duo T7800 LE80537GG0644M Manual Do Utilizador

Códigos do produto
LE80537GG0644M
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Thermal Specifications and Design Considerations
78
Datasheet
5.
Processor TDP requirements in Intel Dynamic Acceleration Technology mode is lesser than TDP in HFM.
6.
At Tj of 100
o
C
7.
At Tj of 50
o
C
8.
At Tj of 35
o
C
9.
4-M L2 cache
10.
2-M L2 cache
NOTES:
1.
The TDP specification should be used to design the processor thermal solution. The TDP is not the 
maximum theoretical power the processor can generate. 
2.
Not 100% tested. These power specifications are determined by characterization of the processor currents 
at higher temperatures and extrapolating the values for the temperature indicated.
3.
As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal Monitor’s automatic 
mode is used to indicate that the maximum T
J
 has been reached. Refer to 
 for more details.
4.
The Intel Thermal Monitor automatic mode must be enabled for the processor to operate within 
specifications.
5.
Processor TDP requirements in Intel Dynamic Acceleration Technology mode is lesser than TDP in HFM.
6.
At Tj of 100
o
C.
7.
At Tj of 50
o
C.
8.
At Tj of 35
o
C.
9.
4-M L2 cache.
Table 20.
Power Specifications for the Intel Core 2 Duo Processor - Low Voltage
Symbol
Processor 
Number
Core Frequency & Voltage
Thermal Design 
Power
Unit
Notes
TDP
L7700
L7500
L7300
1.8 GHz & HFM V
CC
1.6 GHz & HFM V
CC
1.4 GHz & HFM V
CC
1.2 GHZ & LFM V
CC
0.80 GHZ & SuperLFM V
CC
17
17
17
16.1
10.0
W
1, 4, 5, 6, 9
Symbol
Parameter
Min
Typ
Max
Unit
P
AH,
P
SGNT
Auto Halt, Stop Grant Power
at HFM V
CC
at SuperLFM V
CC
5.6
3.9
W
2,  5,  7
P
SLP
Sleep Power 
at HFM V
CC
at SuperLFM V
CC
5.3
3.6
W
2,  5,  7
P
DSLP
Deep Sleep Power 
at HFM V
CC
at SuperLFM V
CC
2.8
2.3
W
2,  5,  8
P
DPRSLP
Deeper Sleep Power
1.3
W
2, 8
P
DC4
Intel® Enhanced Deeper Sleep Power
0.8
W
2, 8
T
J
Junction Temperature
0
100
°C
3,  4