Intel D425KT BOXD425KT Manual Do Utilizador

Códigos do produto

BOXD425KT

Contents

Product Description .............................................................. 9

1.1

Overview.......................................................................................... 9

1.1.1

Feature Summary .................................................................. 9

1.1.2

Board Layout ....................................................................... 11

1.1.3

Block Diagram ..................................................................... 13

1.2

Online Support................................................................................ 14

1.3

Processor ....................................................................................... 14

1.3.1

Intel D425 Graphics Subsystem.............................................. 15

1.4

System Memory .............................................................................. 16

1.5

Intel

NM10 Express Chipset............................................................. 17

1.5.2

USB ................................................................................... 19

1.5.3

SATA Support ...................................................................... 19

1.6

Real-Time Clock Subsystem .............................................................. 20

1.7

Legacy I/O Controller ....................................................................... 20

1.8

LAN Subsystem............................................................................... 21

1.8.1

LAN Subsystem Drivers ......................................................... 21

1.8.2

RJ-45 LAN Connector with Integrated LEDs .............................. 22

1.9

Audio Subsystem............................................................................. 23

1.9.1

Audio Subsystem Software .................................................... 24

1.9.2

Audio Connectors and Headers ............................................... 24

1.10

Hardware Management Subsystem .................................................... 25

1.10.1

Hardware Monitoring............................................................. 25

1.10.2

Thermal Monitoring .............................................................. 26

1.11

Power Management ......................................................................... 27

1.11.1

ACPI................................................................................... 27

1.11.2

Hardware Support ................................................................ 30

Technical Reference............................................................ 33

2.1

Memory Map................................................................................... 33

2.1.1

Addressable Memory............................................................. 33

2.2

Connectors and Headers................................................................... 36

2.2.1

Back Panel .......................................................................... 37

2.2.2

Component-side Connectors and Headers ................................ 39

2.3

BIOS Configuration Jumper Block....................................................... 49

2.4

Mechanical Considerations ................................................................ 51

2.4.1

Form Factor......................................................................... 51

2.5

Electrical Considerations................................................................... 52

2.5.1

Fan Header Current Capability................................................ 52

2.5.2

Add-in Board Considerations .................................................. 52

2.6

Thermal Considerations .................................................................... 52

2.6.1

Passive Heatsink Design in a Passive System Environment ......... 54