ASUS p2z Manual Do Utilizador
8
ASUS P2Z User’s Manual
Features of the ASUS P2Z Motherboard
The ASUS P2Z is carefully designed for the demanding PC user who wants ad-
vanced features processed by the fastest CPU.
vanced features processed by the fastest CPU.
Specifications:
•
•
Multi-Speed: Supports Intel Pentium
®
III (450MHz and faster), Pentium
®
II
(233MHz to 450MHz), and Celeron
TM
(266MHz and faster) processors.
•
Intel AGPset: Features Intel’s 440ZX AGPset with I/O subsystems and front-side
bus (FSB) platform, which boosts the traditional 66MHz internal bus speed to 100MHz.
bus (FSB) platform, which boosts the traditional 66MHz internal bus speed to 100MHz.
•
Multi-Cache: Supports processors with either 512, 128, or 0KB Pipelined Burst
Level 2 cache.
Level 2 cache.
•
PC100 Memory Support: Equipped with two DIMM sockets to support Intel
PC100-compliant SDRAMs (8, 16, 32, 64, or 128MB) up to 256MB. These new
SDRAMs are necessary to meet the critical enhanced 100MHz bus speed require-
ment.
PC100-compliant SDRAMs (8, 16, 32, 64, or 128MB) up to 256MB. These new
SDRAMs are necessary to meet the critical enhanced 100MHz bus speed require-
ment.
•
Peripheral Wake Up: Supports modem wake up, keyboard wake up, and LAN
card wake up functions from sleep or soft-off mode.
card wake up functions from sleep or soft-off mode.
•
Thermal Sensor Connector (only with optional hardware monitor): Accu-
rately detects the CPU temperature with the ASUS Smart Fan or the Intel boxed
processor heatsink with fan when connected to an ASUS P2T-Cable.
rately detects the CPU temperature with the ASUS Smart Fan or the Intel boxed
processor heatsink with fan when connected to an ASUS P2T-Cable.
•
PC Health Monitoring (only with optional hardware monitor): Provides an
easier way to examine and manage system status information such as CPU and
system voltages, temperatures, and fan status through the onboard hardware ASIC
and the bundled LDCM by Intel or PC Probe from ASUS.
easier way to examine and manage system status information such as CPU and
system voltages, temperatures, and fan status through the onboard hardware ASIC
and the bundled LDCM by Intel or PC Probe from ASUS.
•
AGP Slot: Supports an Accelerated Graphics Port card for high performance,
component level interconnect targeted at 3D graphical display applications us-
ing a 1X or 2X mode bus.
component level interconnect targeted at 3D graphical display applications us-
ing a 1X or 2X mode bus.
•
SB-Link™ Connector: Features Creative’s SB-Link™, allowing SB16 com-
patibility, using Intel’s PC-PCI DMA and serialized IRQ protocols, to AWE64D
or compatible PCI audio cards.
patibility, using Intel’s PC-PCI DMA and serialized IRQ protocols, to AWE64D
or compatible PCI audio cards.
•
SMBus: Features the System Management Bus interface, which is used to physi-
cally transport commands and information between SMBus devices.
cally transport commands and information between SMBus devices.
•
PCI & ISA Expansion Slots: Provides four 32-bit PCI and three 16-bit ISA slots.
•
Multi-I/O: Provides two high-speed UART compatible serial ports and one paral-
lel port with EPP and ECP capabilities. UART2 can also be directed from COM2
to the Infrared Module for wireless connections.
lel port with EPP and ECP capabilities. UART2 can also be directed from COM2
to the Infrared Module for wireless connections.
•
UltraDMA/33 Bus Master IDE: Comes with an onboard PCI Bus Master IDE con-
troller with two connectors that support four IDE devices in two channels. Supports
UltraDMA/33, PIO Modes 3 and 4 and Bus Master IDE DMA Mode 2, and supports
Enhanced IDE devices, such as Tape Backup, CD-ROM, CD-R/W, and LS-120 drives.
troller with two connectors that support four IDE devices in two channels. Supports
UltraDMA/33, PIO Modes 3 and 4 and Bus Master IDE DMA Mode 2, and supports
Enhanced IDE devices, such as Tape Backup, CD-ROM, CD-R/W, and LS-120 drives.
II. FEATURES
Specifications
II. FEA
TURES