3M epoxy and hot melt adhesives for electronics Manual Do Utilizador
3M
™
Epoxy and Hot Melt Adhesives have the characteristics and performance profiles to meet most fabrication and assembly application requirements.
3M Epoxy and Hot Melt Specifications
➀
B-12,000
6.0
DP-100
Epoxy
1:1
A-14,000
NA
3-5 min.
15-20 min.
24-48 hr. @ 23ºC
81
2
1500
2
33ºC @ 46ºC
.107
60 x 10
-6
(-50ºC to 30ºC)
(12 mil.)
860
.043
3.5 x 10
12
Poor
UL 94 HB
@ 23ºC
or 1-2 hr. @ 65ºC
Aluminum
Aluminum
Meets corrosion resistance requirements Mil-S-46163
B-100,000
DP-100 NS
Epoxy
1:1
A-90,000
NA
3-5 min.
15-20 min.
24-48 hr. @ 23ºC
80
2
1500
2
34ºC
.106 @ 45ºC
29 x 10
-6
(-50ºC to 30ºC)
•
1100 (12 mil.)
•
2.2 x 10
14
Poor
Low flow version of DP-100
@ 23ºC
or 1-2 hr. @ 65ºC
Aluminum
Aluminum
149 x 10
-6
(50ºC to 110ºC)
B-75,000
DP-100 FR
Epoxy
1:1
A-80,000
NA
4-8 min.
15-20 min.
24-48 hr. @ 23ºC
87
2
1500
2
44ºC
.111 @ 45ºC
60 x 10
-6
(-50ºC to 30ºC)
4.7
•
.016
1.7 x 10
14
•
UL 94 V-O
@ 23ºC
or 1-2 hr. @ 65ºC
Aluminum
Aluminum
125 x 10
-6
(80ºC to 100ºC)
CFR 25.853 Paragraph A
B-7,000
DP-100
Epoxy
1:1
A-10,000
NA
3-4 min.
20 min.
48 hours @ 23ºC
83
75
3500
13
29ºC
.077
93 x 10
-6
(5ºC to 20ºC)
6.6
710
.060
6.7 x 10
11
•
•
Plus Clear
@ 25ºC
Aluminum
Aluminum
182 x 10
-6
(40ºC to 140ºC)
B-4,000
DP-125
Epoxy
1:1
A-26,000
NA
18-28 min.
2.5 hr.
7 days @ 23ºC
55
150
2500
➄
35
➄
15ºC
.089
112 x 10
-6
(5ºC to 20ºC)
6.3
765
.140
1.2 x 10
11
•
•
@ 25ºC
Aluminum
Aluminum
190 x 10
-6
(650ºC to 140ºC)
B-100,000
Flexible • UL 94 HB
DP-190
Epoxy
1:1
A-60,000
NA
90 min.
12-16 hr.
7 days @ 23ºC
60
20
2200
➄
20
➄
20ºC .220
@
44ºC
62 x 10
-6
(-50ºC to 30ºC)
6.5
830 (12 mil.)
.090
5.0 x 10
12
Good
Good adhesion to most metals, ceramics & plastics
Gray
@ 27ºC
or 2 hr. @ 65ºC
Aluminum
Aluminum
177 x 10
-6
(50ºC to 100ºC)
Good for structural bonding
B-22,000
Noncorrosive to copper • UL 94 HB
DP-270
➁
Epoxy
1:1
A-18,000
NA
60-70 min.
4-6 hr.
2 days @ 23ºC
82
2
2400
2
49ºC/48ºC
.101 @ 45ºC/
101 x 10
-6
(-50ºC to 30ºC)/
3.4/3.6
870 (30 mil.)/
.018
4.1 x 10
14
Excellent
Meets corrosion resistance requirement of Mil-S-46163
Clear/Black
@ 23ºC
or 1 hr. @ 80ºC
Aluminum
Aluminum
.105 @ 45ºC
78 x 10
-6
(-50ºC to 30ºC)
700 (30 mil.)
Non-exotherming potting compounds • RI @ 25ºC 1.656
B-35,000
High peel and shear strength
DP-420
Epoxy
2:1
A-10,000
NA
20 min.
2-3 hr.
3-4 days @ 23ºC
80
5
4400
49
58ºC
.104 @ 45ºC
85 x 10
-6
(-50ºC to 30ºC)
4.7
690 (30 mil.)
.016
1.3 x 10
14
Good
Excellent durability
@ 23ºC
or 1-2 hr. @ 65ºC
Aluminum
Aluminum
147 x 10
-6
(50ºC to 110ºC)
Controlled flow • UL 94 HB
B-35,000
7 days @ 23ºC
High peel and shear strength
DP-460
Epoxy
2:1
A-10,000
NA
60 min.
4-6 hr.
or 90 min. @ 70ºC
80
7
4600
50
58ºC
.104 @ 45ºC
59 x 10
-6
(-50ºC to 30ºC)
4.7
1100 (30 mil.)
.010
2.4 x 10
14
Good
Excellent durability
@ 23ºC
or 30 min. @ 93ºC
Aluminum
Aluminum
159 x 10
-6
(50ºC to 110ºC)
Controlled flow • UL 94 HB
B-100,000
2216
Epoxy
2:3
A-60,000
NA
90 min.
8-12 hr.
7 days @ 23ºC
55
40
2500 25
13ºC
.228
102 x 10
-6
(0ºC to 40ºC)
5.5
408
.112
1.9 x 10
12
Good
Flexible
Gray
@ 27ºC
or 2 hr. @ 65ºC
Aluminum
Aluminum
134 x 10
-6
(40ºC to 80ºC)
Meets DOD-A-82720 • UL 94 HB
B-35,000
7 days @ 23ºC
High peel and shear strength
DP- 460 EG
Epoxy
2:1
A-10,000
NA
60 min.
4-6 hr.
or 90 min. @ 70ºC
80
7
4600
50
58ºC RT Cure
.104 @ 45ºC
59 x 10
-6
(-50ºC to 30ºC)
4.6
515 (43 mil.)
.010
2.9 x 10
15
•
Excellent durability
@ 23ºC
or 30 min. @ 93ºC
Aluminum
Aluminum
72ºC Ultimate
159 x 10
-6
(50ºC to 110ºC)
Controlled flow
B-35,000
High peel and shear strength
DP- 4XL EG
Epoxy
2:1
A-12,000
NA
5-6 hr.
12-18 hr.
7 days @ 23ºC
84
•
4500
45
56ºC RT Cure
•
73 x 10
-6
(-50ºC to 30ºC)
3.9
676 (31 mil.)
.010
2.5 x 10
16
•
Excellent durability
@ 23ºC
or 60 min. @ 120ºC
Aluminum
Aluminum
70ºC Ultimate
205 x 10
-6
(50ºC to 110ºC)
Controlled flow
40 min. @ 121ºC
High temperature resistant
2214-HD
Epoxy
NA
Paste 130 sec.
NA
NA
NA
or 10 min. @ 149ºC
85
2
4500 5
110ºC
.231 @ 25ºC
49 x 10
-6
(0ºC to 80ºC)
10.5
77 (37 mil.)
.126
2.8 x 10
13
Good
High impact strength • Metallic filled
@ 23ºC
or 5 min. @ 177ºC
Aluminum
Aluminum
Meets MMM-A-132, Type 1, Class 3 • UL 94 HB
40 min. @ 121ºC
2214 Hi-Flex
Epoxy
NA
Paste 200 sec.
NA
NA
NA
or 10 min. @ 149ºC
81
3
4000
10
84ºC
.193 @ 24ºC
80 x 10
-6
(0ºC to 80ºC)
11.3
83 (42 mil.)
.037
2.8 x 10
13
Good
Deaerated
@ 23ºC
or 5 min. @ 177ºC
Aluminum
Aluminum
Metallic filled • UL 94 HB
40 min. @ 121ºC
2214 NMF
Epoxy
NA
Paste 100 sec.
NA
NA
NA
or 10 min. @ 149ºC
84
2
4000
7
110ºC
.121 @ 43ºC
130 x 10
-6
(-30ºC to 100ºC)
4.7
1500 (9 mil.)
.014
1.5 x 10
14
Good
Good electrical properties
@ 23ºC
or 5 min. @ 177ºC
Aluminum
Aluminum
Non-Metallic filled • UL 94 HB
2290
Epoxy
NA
Solution
NA
NA
NA
Dry 15 min. @ 121ºC
•
4
5500
10
95ºC
•
262 x 10
-6
(-20ºC to 70ºC)
5.2
2400 (4 mil.)
.011
1.2 x 10
15
Good
21% solids, B-stageable
40-80
and Cure 30 min. @ 177ºC
Aluminum
Aluminum
534 x 10
-6
(100ºC to 120ºC)
Passes solder float @ 288ºC
Excellent hot/cold thermal shock resistance
3748
Polyolefin
NA
5000
45-50 sec.
NA
NA
NA
25
900
220
40
•
.101 @ 44ºC
470 x 10
-6
(-10ºC to 30ºC)
2.3
1300
.001
6.0 x 10
17
Good
Noncorrosive to copper
@ 190ºC
FR-4
FR-4
Good polyolefin adhesion • UL 94 V-2
Self-extinguishing UL 94 V-O • UL 1410
3748 V-O
Polyolefin
NA
6500
30 sec.
NA
NA
NA
26
900
220
35
•
.111 @ 41ºC
155 x 10
-6
(-10ºC to 30ºC)
2.3
1400
.001
6.0 x 10
17
Good
Noncorrosive to copper per ASTM D 3482 and MIL S-46163
@ 190ºC
FR-4
FR-4
Good thermal shock • Good electrical properties
Bonds to polyolefins
3764
Ethylene
NA
10,500
35-40 sec.
NA
NA
NA
18
450
390
13
•
.186 @ 45ºC
197 x 10
-6
(-15ºC to 80ºC)
3.0
760
.006
3.3 x 10
15
Good
Good shock resistance
Vinyl Acetate
@ 190ºC
Polypropylene
Canvas
Low cost, clear • UL 94 V-2
High temperature resistance • Meets UL 94 V-O
3779
Polyamide
NA
8000
25-30 sec.
NA
NA
NA
45
300
700
18
•
.114 @ 45ºC
506 x 10
-6
(-30ºC to 130ºC)
4.6
650
.120
5.8 x 10
12
Good
Noncorrosive to copper MIL S-46163
@ 190ºC
Oak
Canvas
Excellent potting material • Good electrical properties
Base
Volume Mix
Viscosity
Bonding Range
Mixed Work
Handling Strength
Full Cure
Shore D
Elongation
Shear Strength
180º Peel
Glass Transition
Thermal Conductivity
Thermal Coefficient of
Dielectric Constant
Dielectric
Dissipation Factor
Volume Resistivity
Electrolytic Corrosion
Product
Resin
Ratio (B:A)
(cps)
Set Time
Life @ 23ºC
@ 23ºC
Schedule
Hardness
(%)
(psi)
Strength (piw)
Temperature (Tg)
(btu-ft./sq.ft.-hr.ºF)
Expansion (in./in./ºC)
(1 KHZ @ 23ºC)
Strength (volts/mil.)
(1 KHZ @ 23ºC)
(ohm-cm. @ 23ºC)
to Copper
Comments
Scotch
-W
eld
T
w
o-P
ar
t Epo
xy Adhesi
v
es
Scotch
-W
eld
One-P
ar
t Epo
xy Adhesi
v
es
J
et-melt
Hot Melt Adhesi
v
es
Typical Physical Properties
Typical Thermal Properties
Typical Electrical Properties
NA = Not Applicable
•
= Not Available ➀Note: This technical information and data should be considered representative or typical only and should not be used for specification purposes. ➁Scotch-Weld Potting Compound ➂3 hrs. at 85°C GC/MS ➃Water extraction, IC ➄RT cure with 160°F, 2 hr. post cure ➅7-day RT cure
0362220 Epoxy-Hotmelt 3/30/04 11:30 AM Page 2