Intel Xeon E5420 SLANV Manual Do Utilizador
Códigos do produto
SLANV
3
Features
Benefits
New 45nm enhanced Intel® Core™
microarchitecture
• Boosts performance on multiple applications/user environments and data-demanding
workloads, while enabling denser deployments through improved performance-per-watt.
• Reduced idle processor power lowers average power consumption.
Multi-core processing
• Increases performance and headroom for multi-threaded applications and heavy
multi-tasking scenarios.
• Helps boost system utilization through virtualization and application responsiveness.
5400 series: 12 MB on-die L2 cache (2x6 MB)
5200 series: 6 MB on-die L2 cache
3000 series: 3 MB on-die L2 cache
• Increases efficiency of L2 cache-to-core data transfers and maximizes main memory-to-
processor bandwidth.
• Reduces latency by storing larger data sets closer to the processor, reducing the number of trips
to main memory.
Intel® Virtualization Technology
2
• A suite of processor enhancements assists software to deliver more efficient virtualization
solutions and greater capabilities, including 64-bit guest OS support.
• Intel® VT FlexPriority, a new Intel® VT extension, optimizes virtualization software efficiency by
improving interrupt handling.
5
• Intel® VT FlexMigration enables Intel® Xeon® processor 5400 and 5200 series-based
systems to be added to the existing virtualization pool with single, 2, or 4+ socket Intel Core
microarchitecture-based systems.
microarchitecture-based systems.
Intel® 64 architecture
3
• Flexibility for 64-bit and 32-bit applications and operating systems.
Ultra-dense low-power processor
options (L5408 at 40 W TDP)
• Improves performance-per-watt.
• Reduces power/thermal operating costs and improves density.
• Ideal for NEBS Level-3 ambient operating temperature specifications (thermal profile).
• Ideal for smaller form factors with thermal constraints (blades), especially solutions that require
• Reduces power/thermal operating costs and improves density.
• Ideal for NEBS Level-3 ambient operating temperature specifications (thermal profile).
• Ideal for smaller form factors with thermal constraints (blades), especially solutions that require
compliance with AdvancedTCA* form factor specifications (PICMG 3.0).
Embedded lifecycle product support
• Protects system investment with extended product availability.
47 new Intel® SSE4 instructions
• Improves performance of media and high-performance computing applications such as compiler,
imaging, video and graphics applications.
Intel® Xeon® Processors for Embedded Computing Platforms
(All processors utilize the LGA 771 Package)
Processor Name
Product Number
Core
Count
Core
Speed
L2
Cache
FSB
Speed
TDP
Optimized for
Low Power
and/or
ATCA/NEBS
Tcase
(Highest
short
term/
Nominal)
Validated
with Intel®
5000P
chipset
Validated
with Intel®
5100 MCH
chipset
Intel® Xeon® processor E5440
Δ
AT80574KJ073N
Quad-Core 2.83 GHz
12 MB
1333 MHz
80 W
No
67° C
Yes
No
Intel® Xeon® processor L5410
Δ
AT80574JJ053N
Quad-Core 2.33 GHz
12 MB
1333 MHz
50 W
Yes
57° C
Yes
Yes
Intel® Xeon® processor L5408
Δ
AT80574JH046NT
Quad-Core 2.13 GHz
12 MB
1066 MHz
40 W
Yes
87° C/72° C
Yes
Yes
Intel® Xeon® processor E5240
Δ
AT80573QJ0806M
Dual-Core
3.0 GHz
6 MB
1333 MHz
65 W
No
66° C
Yes
No
Intel® Xeon® processor E5220
Δ
AT80573QJ0536M
Dual-Core
2.33 GHz
6 MB
1333 MHz
65 W
No
66° C
Yes
Yes
Intel® Xeon® processor L5238
Δ
AT80573JJ0676MT
Dual-Core
2.66 GHz
6 MB
1333 MHz
35 W
Yes
86° C/71° C
Yes
Yes
Intel® Xeon® processor L3014
Δ
(Single processor configurations only)
AT80588JH0563M
Single-
Core
2.4 GHz
3 MB
1066 MHz
30 W
Yes
75° C/60° C
No
Yes