Intel BX80635E52697V2 Manual Do Utilizador

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Intel® Xeon® Processor E5-1600 v2/E5-2600 v2 Product Families
101
Datasheet Volume One of Two
 
Thermal Management Specifications
5.1.2
T
CASE
 and DTS Based Thermal Specifications
To simplify compliance to thermal specifications at processor run time, the processor 
has added a Digital Thermal Sensor (DTS) based thermal specification. Digital Thermal 
Sensor reports a relative die temperature as an offset from TCC activation 
temperature. T
CASE
 thermal based specifications are used for heat sink sizing and DTS 
based specs are used for acoustic and fan speed optimizations. For the processor 
family, firmware (for example, BMC or other platform management devices) will have 
DTS based specifications for all SKUs programmed by the customer. Some SKUs at a 
sharing the same TDP may share a common T
CASE
 thermal profile but they will have 
separate T
DTS
 based thermal profiles.
The processor fan speed control is managed by comparing DTS thermal readings via 
PECI against the processor-specific fan speed control reference point, or Tcontrol. Both 
Tcontrol and DTS thermal readings are accessible via the processor PECI client. At a 
one time readout only, the Fan Speed Control firmware will read the following:
• TEMPERATURE_TARGET MSR
• Tcontrol via PECI - RdPkgConfig()
• TDP via PECI - RdPkgConfig() 
• Core Count - RdPCIConfigLocal()
DTS PECI commands will also support DTS temperature data readings. Please see 
 for PECI command details.
Also, refer to the Intel® Xeon® Processor E5-1600/2600/4600 v1 and v2 Product 
Families Thermal / Mechanical Design Guide
 for details on DTS based thermal solution 
design considerations.