Intel BX80635E52697V2 Manual Do Utilizador

 

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Intel® Xeon® Processor E5-1600 v2/E5-2600 v2 Product Families 

Datasheet Volume One of Two

Network Equipment Building System (NEBS) is the most common set of environmental 

design guidelines applied to telecommunications equipment in the United States. 

Embedded server SKU’s target operation at higher case temperatures and/or NEBS 
thermal profiles for embedded communications server and storage form factors. The 

term “Embedded” is used to refer to those segments collectively. Thermal profiles in 

this section pertain only to those specific Embedded SKU’s. 

The Nominal Thermal Profile must be used for standard operating conditions or for 

products that do not require NEBS Level 3 compliance.

The Short-Term Thermal Profile may only be used for short-term excursions to higher 
ambient operating temperatures, not to exceed 96 hours per instance, 360 hours per 

year, and a maximum of 15 instances per year, as intended by NEBS Level 3.  

Operation at the Short-Term Thermal Profile for durations exceeding 360 hours per year 
violate the processor thermal specifications and may result in permanent damage to 

the processor.

Implementation of the defined thermal profile should result in virtually no TCC 
activation. Refer to the Intel® Xeon® Processor E5-1600/2600/4600 v1 and v2 
Product Families Thermal / Mechanical Design Guide

 for system and environmental 

implementation details.

Thermal Design Power (TDP) should be used for processor thermal solution design 
targets. TDP is not the maximum power that the processor can dissipate. TDP is 

measured at specified maximum T

CASE

.