jetway 866asr4a Manual Do Utilizador
2
Manual Revision Information
Reversion
Revision History
Date
4.0
Fourth Edition
July 2002
Item Checklist
5
866AS/866AS-R/866ASE
5
Cable for IDE/Floppy
5
CD for motherboard utilities
□
Cable for USB Port 3/4 (Option)
□
Cable for IDE RAID (only for 866AS-R)
5
866AS/866AS-R/866ASE User’s Manual
AMD Athlon™ / Duron™ Processor Family
Cooling Solutions
As processor technology pushes to faster speeds and higher performance, thermal
management becomes increasingly crucial when building computer systems.
Maintaining the proper thermal environment is key to reliable, long-term system
operation. The overall goal in providing the proper thermal environment is keeping the
processor below its specified maximum case temperature. Heatsinks induce improved
processor heat dissipation through increased surface area and concentrated airflow
from attached fans. In addition, interface materials allow effective transfers of heat
from the processor to the heatsink. For optimum heat transfer, AMD recommends the
use of thermal grease and mounting clips to attach the heatsink to the processor.
When selecting a thermal solution for your system, please refer to the website below
for collection of heatsinks evaluated and recommended by AMD for use with AMD
processors. Note, those heatsinks are recommended for maintaining the specified
Maximum T case requirement. In addition, this collection is not intended to be a
comprehensive listing of all heatsinks that support AMD processors.
For vendor list of heatsink and fan, please visit：
http://www1.amd.com/products/duron/thermals
http://www1.amd.com/products/athlon/thermals
management becomes increasingly crucial when building computer systems.
Maintaining the proper thermal environment is key to reliable, long-term system
operation. The overall goal in providing the proper thermal environment is keeping the
processor below its specified maximum case temperature. Heatsinks induce improved
processor heat dissipation through increased surface area and concentrated airflow
from attached fans. In addition, interface materials allow effective transfers of heat
from the processor to the heatsink. For optimum heat transfer, AMD recommends the
use of thermal grease and mounting clips to attach the heatsink to the processor.
When selecting a thermal solution for your system, please refer to the website below
for collection of heatsinks evaluated and recommended by AMD for use with AMD
processors. Note, those heatsinks are recommended for maintaining the specified
Maximum T case requirement. In addition, this collection is not intended to be a
comprehensive listing of all heatsinks that support AMD processors.
For vendor list of heatsink and fan, please visit：
http://www1.amd.com/products/duron/thermals
http://www1.amd.com/products/athlon/thermals
Chapter 1