Intel 4 515/515J JM80547PE0771M Manual Do Utilizador
Códigos do produto
JM80547PE0771M
Datasheet
5
Contents
Figures
2-1 Phase Lock Loop (PLL) Filter Requirements.............................................................................. 19
2-2 VCC Static and Transient Tolerance for 775_VR_CONFIG_04A............................................... 28
2-3 VCC Static and Transient Tolerance for 775_VR_CONFIG_04B............................................... 30
2-4 VCC Overshoot Example Waveform .......................................................................................... 33
3-1 Processor Package Assembly Sketch ........................................................................................ 35
3-2 Processor Package Drawing 1 ................................................................................................... 36
3-3 Processor Package Drawing 2 ................................................................................................... 37
3-4 Processor Package Drawing 3 ................................................................................................... 38
3-5 Processor Top-Side Marking Example ....................................................................................... 40
3-6 Processor Top-Side Marking Example for Processors Supporting Intel
2-2 VCC Static and Transient Tolerance for 775_VR_CONFIG_04A............................................... 28
2-3 VCC Static and Transient Tolerance for 775_VR_CONFIG_04B............................................... 30
2-4 VCC Overshoot Example Waveform .......................................................................................... 33
3-1 Processor Package Assembly Sketch ........................................................................................ 35
3-2 Processor Package Drawing 1 ................................................................................................... 36
3-3 Processor Package Drawing 2 ................................................................................................... 37
3-4 Processor Package Drawing 3 ................................................................................................... 38
3-5 Processor Top-Side Marking Example ....................................................................................... 40
3-6 Processor Top-Side Marking Example for Processors Supporting Intel
EM64T ...................... 41
3-7 Processor Land Coordinates (Top View).................................................................................... 42
4-1 Landout Diagram (Top View – Left Side).................................................................................... 44
4-2 Landout Diagram (Top View – Right Side) ................................................................................. 45
5-1 Thermal Profile for Processors with PRB = 1 ............................................................................. 77
5-2 Thermal Profile for Processors with PRB = 0 ............................................................................. 78
5-3 Case Temperature (TC) Measurement Location ........................................................................ 79
5-4 Thermal Monitor 2 Frequency and Voltage Ordering ................................................................. 81
6-1 Processor Low Power State Machine......................................................................................... 87
7-1 Mechanical Representation of the Boxed Processor.................................................................. 89
7-2 Space Requirements for the Boxed Processor (Side View) ....................................................... 90
7-3 Space Requirements for the Boxed Processor (Top View) ........................................................ 90
7-4 Space Requirements for the Boxed Processor (Overall View) ................................................... 91
7-5 Boxed Processor Fan Heatsink Power Cable Connector Description ........................................ 92
7-6 Baseboard Power Header Placement Relative to Processor Socket ......................................... 93
7-7 Boxed Processor Fan Heatsink Airspace Keepout Requirements (Top View) ........................... 94
7-8 Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side View) .......................... 94
7-9 Boxed Processor Fan Heatsink Set Points................................................................................. 95
4-1 Landout Diagram (Top View – Left Side).................................................................................... 44
4-2 Landout Diagram (Top View – Right Side) ................................................................................. 45
5-1 Thermal Profile for Processors with PRB = 1 ............................................................................. 77
5-2 Thermal Profile for Processors with PRB = 0 ............................................................................. 78
5-3 Case Temperature (TC) Measurement Location ........................................................................ 79
5-4 Thermal Monitor 2 Frequency and Voltage Ordering ................................................................. 81
6-1 Processor Low Power State Machine......................................................................................... 87
7-1 Mechanical Representation of the Boxed Processor.................................................................. 89
7-2 Space Requirements for the Boxed Processor (Side View) ....................................................... 90
7-3 Space Requirements for the Boxed Processor (Top View) ........................................................ 90
7-4 Space Requirements for the Boxed Processor (Overall View) ................................................... 91
7-5 Boxed Processor Fan Heatsink Power Cable Connector Description ........................................ 92
7-6 Baseboard Power Header Placement Relative to Processor Socket ......................................... 93
7-7 Boxed Processor Fan Heatsink Airspace Keepout Requirements (Top View) ........................... 94
7-8 Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side View) .......................... 94
7-9 Boxed Processor Fan Heatsink Set Points................................................................................. 95