IBM 3850 X6 3837A4G Ficha De Dados

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3837A4G
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Through differentiated X6 self-healing technology, the  
x3850 X6 maximizes uptime by proactively identifying potential 
failures and transparently taking necessary corrective actions. 
These unique IBM features include:
●● ●
Advanced Page Retire—proactively protects applications 
from corrupt pages in memory, crucial for scaling memory  
to terabytes.
●● ●
Processor High Availability—allows the platform to maintain 
access to networking and storage and server management 
during a processor failure
●● ●
Rolling Firmware Update Upward Integration Module—
enables concurrent updating of the system firmware with no 
impact on application performance or availability
●● ●
RAS Upward Integration Module—enables the creation and 
management of policies to maintain high availability of  
virtual machines
●● ●
x3850 X6 modular design—reduces service time by enabling 
quick easy replacement of failed components. 
These built-in technologies drive the outstanding system avail-
ability and uninterrupted application performance needed to 
host business-critical applications.
Fast. Agile. Resilient.
A fast, agile and resilient technology infrastructure makes meet-
ing the needs of your enterprise easier. X6 platforms help you 
reduce costs and complexity and deliver the breakthrough  
performance and capacity your applications demand. X6 servers 
are the result of more than 15 years of EXA investment and 
innovation in industry-standard servers. X6 platforms are 
backed by a 100-year history of market-leading IBM technol-
ogy designed to solve customers’ most pressing business 
problems.
For more information
To learn more about IBM System x3850 X6, visit:  
contact your IBM representative or IBM Business Partner.
  © Copyright IBM Corporation 2014
IBM Systems and Technology Group 
Route 100 
Somers, NY 10589
Produced in the United States of America 
February 2014
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1
When a newer generation of processor and memory technology becomes 
available, Compute Books can be replaced with newer ones. (All Compute 
Books must use matching technology.)
2
Up to 28 percent savings in acquisition cost is based on a comparison of 
an x3850 X6 (using the modular design) vs. a traditional rack design  
with no modularity. Based on projected Q1 2014 pricing of x3850 X6 
configuration with 2 Compute Books, Storage Book with 1.2TB SAS,  
dual 1400W power supplies, 10GbE SFP+ networking, and no optional 
I/O Books.
3
100 percent performance improvement is based on preliminary results  
of SPECint*_rate_base2006, SPECfp*_rate_base2006, and TPC-E 
benchmarks, plus performance gains from eXFlash DIMM storage.  
SPEC and TPC benchmark results will be available at 
, respectively, after 2/18/14. Configurations: 4-socket  
x3850 X6 server using Intel Xeon processor E7-4890 v2 vs. 4-socket 
server using the previous top-of-the-line E7-4870 (v1).
4
Laboratory testing shows eXFlash DIMMs can deliver 3 times lower 
latency (<5 microsecond) than PCIe based flash (15-19us).
 
 
 
 
 
 
 
 
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