Acer Intel Celeron G530 KC.53001.CDG Manual Do Utilizador

Acer

Códigos do produto

KC.53001.CDG

6

Intel

®

Celeron

®

Processor on 0.13 Micron Process in the 478-Pin Package Datasheet

Tables

References.......................................................................................................... 11

VCCVID Pin Voltage Requirements.................................................................... 15

Voltage Identification Definition........................................................................... 16

System Bus Pin Groups ...................................................................................... 19

BSEL[1:0] Frequency Table for BCLK[1:0] ......................................................... 20

Processor DC Absolute Maximum Ratings ......................................................... 21

Voltage and Current Specifications..................................................................... 22

VCC Static and Transient Tolerance................................................................... 23

System Bus Differential BCLK Specifications ..................................................... 25

AGTL+ Signal Group DC Specifications ............................................................. 25

Asynchronous GTL+ Signal Group DC Specifications ........................................ 26

PWRGOOD and TAP Signal Group DC Specifications ...................................... 26

ITPCLKOUT[1:0] DC Specifications.................................................................... 27

BSEL [1:0] and VID[4:0] DC Specifications......................................................... 27

AGTL+ Bus Voltage Definitions........................................................................... 28

System Bus Differential Clock Specifications...................................................... 29

System Bus Common Clock AC Specifications .................................................. 29

System Bus Source Synch AC Specifications AGTL+ Signal Group .................. 30

Miscellaneous Signals AC Specifications ........................................................... 31

System Bus AC Specifications (Reset Conditions) ............................................. 31

TAP Signals AC Specifications ........................................................................... 31

ITPCLKOUT[1:0] AC Specifications.................................................................... 32

BCLK Signal Quality Specifications .................................................................... 41

Ringback Specifications for AGTL+ and Asynchronous GTL+ Signals
Groups ................................................................................................................ 42

Ringback Specifications for PWRGOOD Input and TAP Signal Group .............. 43

1.525V VID Source Synchronous (400 MHz) AGTL+ Signal Group
Overshoot/Undershoot Tolerance ....................................................................... 47

1.525 V VID Source Synchronous (200 MHz) AGTL+ Signal Group
Overshoot/Undershoot Tolerance ....................................................................... 48

1.525 V VID Common Clock (100 MHz) AGTL+ Signal Group
Overshoot/Undershoot Tolerance ....................................................................... 48

1.525 V VID Asynchronous GTL+, PWRGOOD Input, and TAP Signal
Group Overshoot/Undershoot Tolerance ............................................................ 48

Description Table for Processor Dimensions ...................................................... 52

Package Dynamic and Static Load Specifications .............................................. 54

Processor Mass .................................................................................................. 55

Processor Material Properties............................................................................. 55

Pin Listing by Pin Name ...................................................................................... 60

Pin Listing by Pin Number................................................................................... 66

Signal Description ............................................................................................... 72

Processor Thermal Design Power ...................................................................... 83

Power-On Configuration Option Pins .................................................................. 85

Thermal Diode Parameters ................................................................................. 90

Thermal Diode Interface...................................................................................... 90

Fan Heatsink Power and Signal Specifications................................................... 95

Boxed Processor Fan Heatsink Set Points ......................................................... 99