DELL Xeon Phi 7120A 489-BBBZ Ficha De Dados
Códigos do produto
489-BBBZ
Document ID Number: 328209 003EN
Intel
®
Xeon Phi™ Coprocessor Datasheet
47
4.2
Supplemental Power Connector(s)
The Intel
®
Xeon Phi™ coprocessor gets only maximum 75W from the PCI Express*
connector, per the PCI Express* specification. The 2x4 and 2x3 supplemental power
connectors on the coprocessor card provide the additional +12-volt power needed by
the coprocessor. Per the PCI Express* specifications, the 2x4 connector must be
capable of maximum 150W power draw by the coprocessor, and the 2x3 must be
capable of maximum 75W power. The 300W TDP products of the Intel
connectors on the coprocessor card provide the additional +12-volt power needed by
the coprocessor. Per the PCI Express* specifications, the 2x4 connector must be
capable of maximum 150W power draw by the coprocessor, and the 2x3 must be
capable of maximum 75W power. The 300W TDP products of the Intel
®
Xeon Phi™
coprocessor family must have power supplied to the 2x4 and the 2x3 connectors. The
225W products can have either a single 2x4 connector connected to a power supply, or
two 2x3 connectors (each capable of maximum 75W power draw). Within the
coprocessor, the power rails from the three sources are not connected to each other.
Instead, the Intel
225W products can have either a single 2x4 connector connected to a power supply, or
two 2x3 connectors (each capable of maximum 75W power draw). Within the
coprocessor, the power rails from the three sources are not connected to each other.
Instead, the Intel
®
Xeon Phi™ coprocessor is designed to draw power proportionally
from the three power sources. During coprocessor power-up, sensors on the
coprocessor card detect presence of power supplies to the supplemental connectors,
and depending on the maximum TDP of the coprocessor, can determine if sufficient
power is available to power up the card. For example, sensors on a 300W coprocessor
card must detect both 2x4 and 2x3 power supplies in order for the card to be powered
up and function properly.
coprocessor card detect presence of power supplies to the supplemental connectors,
and depending on the maximum TDP of the coprocessor, can determine if sufficient
power is available to power up the card. For example, sensors on a 300W coprocessor
card must detect both 2x4 and 2x3 power supplies in order for the card to be powered
up and function properly.
4.3
Dense Form Factor (5120D) Edge Connector Pins
The Intel
®
Xeon Phi™ coprocessor 5120D SKU (DFF) uses a 230-pin edge finger
designed to industry standard x24 PCI Express* connector, PCI Express* Gen2
compliant. Unlike the other SKUs in the Intel
compliant. Unlike the other SKUs in the Intel
®
Xeon Phi™ coprocessor family, the
5120D SKU requires PCI Express* signal routing and +12V filter per card on the
baseboard.
baseboard.
The symbol _N at the end of a signal name indicates that the active or asserted state
occurs when that signal is at a low voltage level.
occurs when that signal is at a low voltage level.
The following notations are used to describe the signal type:
Type
Details
I
Signal is an Input to the baseboard from 5120D.
O
Signal is an Output from the baseboard to 5120D.
I/O
Bidirectional I/O signal.
Power:
+12V,
+3.3V,
+12V,
+3.3V,
+3.3V_AUX,
GND
Power supply and GND inputs to the 5120D are sourced from the
baseboard. On the 5120D, the +3.3V_AUX power supply is not
electrically routed on the board. The baseboard may choose either to
connect +3.3V_AUX supply to this pin or to leave it as No-Connect.
RSVD
Indicates the pin is not defined and may be used for future products.
NC next to this type of signal indicates that this pin must not be
routed on the baseboard.