Wago 2059-189, -Way PCB Spring Terminal Block White 2059-189 Ficha De Dados
Códigos do produto
2059-189
54
1
54
1
Approvals are available online at: www.wago.com For more technical information, see Section 11
SMD Terminal Blocks 0.34 mm
2
Pin Spacing 3 mm , white
2059 Series
●
SMD terminal blocks with PUSH WIRE
®
connection
●
Inserting solid conductors via push-in termination
●
Easy conductor removal, via operating tool
●
A total height of only 2.7 mm
●
Group arrangement is possible without losing any poles
●
Delivery in tape-and-reel packaging for automated assembly
Technical data:
Pin Spacing
3 mm
0.118 in
Rating per
IEC/EN 60664-1
Overvoltage category
III
III
II
Pollution degree
3
2
2
Rated voltage
63 V 160 V 320 V
Rated surge voltage
2.5 kV 2.5 kV 2.5 kV
Nominal current
3 A
3 A
3 A
Approvals per
Rated voltage,1-pole
Rated voltage for 2 poles and more
Nominal current UL
Rated voltage,1-pole
Rated voltage for 2 poles and more
Nominal current UL
Material data:
Material group
Material group
I
Insulating material
Glass fiber-reinforced polyphthalamide (PPA-GF)
Flammability rating per UL 94
V0
Lower/Upper temperature limit
–60 °C / +105 °C
Clamping spring material
Copper alloy
Contact plating
tin-plated
Conductor data:
Connection technology
Connection technology
PUSH WIRE
Conductor size: solid
0.14 – 0.34 mm
2
AWG
26 – 22 “sol.“
Strip length
4 – 5.5 mm / 0.16 – 0.22 in
Conductor entry angle
0° to PCB
2059 Series accessories:
Operating tool (206-859)
Operating tool (2059-189)
Operating tool (2059-189)
Application notes:
Suitable for lead-free, reflow-soldering profiles acc. to DIN EN 61760-1 and IEC 60068-2-58 up to max. 260 °C peak
temperature. Due to customer specific variables (e.g., component configuration and orientation, type of soldering machine,
solder paste), it is recommended that trial runs are conducted to ensure product and process compatibility under actual
manufacturing conditions.
Recommendation for stencil: Material thickness, 150 µm. Stencil layout identical to pad layout.
Suitable for lead-free, reflow-soldering profiles acc. to DIN EN 61760-1 and IEC 60068-2-58 up to max. 260 °C peak
temperature. Due to customer specific variables (e.g., component configuration and orientation, type of soldering machine,
solder paste), it is recommended that trial runs are conducted to ensure product and process compatibility under actual
manufacturing conditions.
Recommendation for stencil: Material thickness, 150 µm. Stencil layout identical to pad layout.