Intel Xeon 3.20GHz Processor RK80546KG0882MM Manual Do Utilizador
Códigos do produto
RK80546KG0882MM
R
mPGA604 Socket
3
Mechanical Design Guide
Contents
1
Introduction ....................................................................................................................... 7
1.1
Objective ................................................................................................................7
1.2
Purpose.................................................................................................................. 7
1.3
Scope .....................................................................................................................7
2
Assembled Component and Package Description........................................................ 9
3
Mechanical Requirements.............................................................................................. 11
3.1
Attachment ...........................................................................................................11
3.2
Materials...............................................................................................................11
3.2.1
Socket Housing....................................................................................... 11
3.2.2
Color........................................................................................................ 11
3.3
Cutouts for Package Removal .............................................................................11
3.4
Socket Standoffs Height ......................................................................................11
3.5
Markings...............................................................................................................12
3.5.1
Name....................................................................................................... 12
3.5.2
Lock (Closed) and Unlock (Open) Markings........................................... 12
3.5.3
Lot Traceability........................................................................................ 12
3.6
Socket Size ..........................................................................................................12
3.7
Socket/Package Translation During Actuation ....................................................13
3.8
Orientation in Packaging, Shipping and Handling ...............................................13
3.9
Contact Characteristics........................................................................................13
3.9.1
Number of contacts................................................................................. 13
3.9.2
Base Material .......................................................................................... 13
3.9.3
Contact Area Plating ............................................................................... 13
3.9.4
Solder Ball Attachment Area Plating....................................................... 13
3.9.5
Solder Ball Characteristics...................................................................... 13
3.9.6
Lubricants................................................................................................ 13
3.10
Material and Recycling Requirements .................................................................13
3.11
Lever Actuation Requirements.............................................................................14
3.12
Socket Engagement/Disengagement Force ........................................................14
3.13
Visual Aids ...........................................................................................................14
3.14
Socket BGA Co-Planarity.....................................................................................14
3.15
Solder Ball True Position .....................................................................................14
3.16
Critical-to-Function Dimensions ...........................................................................14
4
Electrical Requirements ................................................................................................. 17
4.1
Electrical Resistance............................................................................................18
4.2
Determination of Maximum Electrical Resistance ............................................... 22
4.3
Inductance............................................................................................................23
4.3.1
Design Procedure for Inductance Measurements .................................. 24
4.3.2
Correlation of Measurement and Model Data Inductance ...................... 25
4.4
Pin-to-Pin Capacitance ........................................................................................25
4.5
Dielectric Withstand Voltage ................................................................................25
4.6
Insulation Resistance...........................................................................................25
4.7
Contact Current Rating ........................................................................................25
5
Environmental Requirements ........................................................................................ 27
5.1
Mixed Flowing Gas ..............................................................................................28