Intel Core™2 Duo Processor E8500 (6M Cache, 3.16 GHz, 1333 MHz FSB) BX80570E8500A Manual Do Utilizador
Códigos do produto
BX80570E8500A
Balanced Technology Extended (BTX) Thermal/Mechanical Design Information
52
Thermal and Mechanical Design Guidelines
Note: These preload and stiffness recommendations are specific to the TMA mounting
scheme that meets the BTX Interface Specification and Support Retention Mechanism
(SRM) Design Guide. For TMA mounting schemes that use only the motherboard
mounting hole position for TMA attach, the required preload is approximately 10–15N
greater than the values stipulated in Figure
(SRM) Design Guide. For TMA mounting schemes that use only the motherboard
mounting hole position for TMA attach, the required preload is approximately 10–15N
greater than the values stipulated in Figure
5-6; however, Intel has not conducted any
validation testing with this TMA mounting scheme.
Figure
5-7. Thermal Module Attach Pointes and Duct-to-SRM Interface Features
SRM
Front attach point
use 6x32 screw
See detail A
use 6x32 screw
See detail A
Detail A
See detail B
Detail B
Rear attach point
use 6x32 screw
use 6x32 screw
Chassis PEM nut
Duct front interface
feature see note 2
SRM
Front attach point
use 6x32 screw
See detail A
use 6x32 screw
See detail A
Detail A
See detail B
Detail B
Rear attach point
use 6x32 screw
use 6x32 screw
Chassis PEM nut
Duct front interface
feature see note 2
NOTES:
1.
For clarity the motherboard is not shown in this figure. In an actual assembly, the
captive 6x32 screws in the thermal module pass through the rear holes in the
motherboard designated in the socket keep-in Figure
motherboard designated in the socket keep-in Figure
2.
This front duct ramp feature has both outer and inner lead-in that allows the feature to
slide easily into the SRM slot and around the chassis PEM nut. Note that the front PEM
nut is part of the chassis not the SRM.