Bungard COTHERM 2,2 W/MK 1X 35#M CU 100X160X1,5 161156E33 Manual Do Utilizador
Códigos do produto
161156E33
Bungard Presensitized Base Material
Manual
page 4 / 4
Development
Decisive influence on development have the right concentration and temperature of the developer.
However, the processing latitude at our photoresist is so high that development is rather a less
common sources of errors/problems.
Low temperature, low concentration and used up developer will delay the development process. Too
high temperature or concentration will lead to interrupts and holes in the conductor tracks.
A bad result you will get with double-sided boards, when air bubbles are trapped underneath the
bottom side of the pcb.
Etching
When etching with acid etching media most errors have their cause in the previous processes. A
diamond-shaped pattern of remaining copper on the free surfaces of the pcb for example, is usually
caused by too short exposure.
The photo layer is resistant to all conventional acid etching media. Alkaline etching is also possible,
provided that a pH value of 9.5 is not exceeded, and the pcb was not exposed to daylight before.
The resolution of the photo resist is in the range of a few micrometers. However due to the inevitable
etching undercut, a structure width of less than 70 microns is rarely exceeded with a copper layer of
35 microns.
Special influence on the etching results have of course the etchant agent and the kind of etching
machine. Rapid etching gives always a better result with a finer line resolution. Spray etching with its
fast media exchange and energy of the spray beam perpendicular to the surface increases both the
speed and the precision of the result. For example, our JET 34d achieves with fresh, warm ferric(III)
chloride an etching time of 90 seconds for 35 microns copper and a structure resolution better than
100µm.
The use of sodium or ammonium persulfate, however, is not state of art any more and with regards to
special waste prevention even inadmissible. For further details please contact the manufacturer of
your etching machine.
Decisive influence on development have the right concentration and temperature of the developer.
However, the processing latitude at our photoresist is so high that development is rather a less
common sources of errors/problems.
Low temperature, low concentration and used up developer will delay the development process. Too
high temperature or concentration will lead to interrupts and holes in the conductor tracks.
A bad result you will get with double-sided boards, when air bubbles are trapped underneath the
bottom side of the pcb.
Etching
When etching with acid etching media most errors have their cause in the previous processes. A
diamond-shaped pattern of remaining copper on the free surfaces of the pcb for example, is usually
caused by too short exposure.
The photo layer is resistant to all conventional acid etching media. Alkaline etching is also possible,
provided that a pH value of 9.5 is not exceeded, and the pcb was not exposed to daylight before.
The resolution of the photo resist is in the range of a few micrometers. However due to the inevitable
etching undercut, a structure width of less than 70 microns is rarely exceeded with a copper layer of
35 microns.
Special influence on the etching results have of course the etchant agent and the kind of etching
machine. Rapid etching gives always a better result with a finer line resolution. Spray etching with its
fast media exchange and energy of the spray beam perpendicular to the surface increases both the
speed and the precision of the result. For example, our JET 34d achieves with fresh, warm ferric(III)
chloride an etching time of 90 seconds for 35 microns copper and a structure resolution better than
100µm.
The use of sodium or ammonium persulfate, however, is not state of art any more and with regards to
special waste prevention even inadmissible. For further details please contact the manufacturer of
your etching machine.
Disclaimer of Warranty
This instruction was carefully edited. Nevertheless we cannot give any warranty.
Copyright
© 1989-2013 Bungard Elektronik.
Bungard Elektronik GmbH & Co. KG, Rilkestraße 1, 51570 Windeck – Germany
Tel.: +49 (0) 2292/5036, Fax: +49 (0) 2292/6175, E-mail: support@bungard.de