Bungard COTHERM 2,2 W/MK 1X 35#M CU 200X300X1,5 161156E35 Ficha De Dados
Códigos do produto
161156E35
BEL Cotherm®
page 1 /2
Product description
The insulating metal substrate (IMS) consists of an aluminium basis plate on the lower surface and an ED Copper foil on the
top side. The product is particularly meant for applications where dissipation of heat is important. For this reason there is an
electrically isolating layer consisting of glass fabric combined with a mixture from epoxy resin and ceramic(s) between the alu-
minium and the copper foil. This layer guarantees a very good thermal conduction, a high dielectric strength and a continuous
high temperature resistance. Processing and assembly (solder) can be accomplished with the usual processes. Aluminium
basis plate is provided with a foil, which protects aluminium during the wet processes of the printed circuit board production
process.
BEL Cotherm® fulfills the ROHS directive 2002/95/EC.
BEL Cotherm® fulfills the ROHS directive 2002/95/EC.
STANDARD CONSTRUCTIONS
Aluminium thickness in µm
1000 - 1500 - 2000
Aluminium Alloy Treat
5052 H18
Insulation thickness in µm
100
Dielectric thickness tolerance µm
+ 10
Copper thickness (ED) in µm
35
Other constructions available on request
PROPERTIES
1500 µm AI / 130 µm dielectric /70 µm Cu
1500 µm AI / 130 µm dielectric /70 µm Cu
TEST
METHOD
Units
TYPICAL
VALUES
Guaranteed
values
Time to blister at 288°C, floating on solder (50 x 50 mm)
IEC-61189
See
>120
>120
Copper Peel strength, after heat shock 20 sec/288°C
IPC-TM 650-2.4.8
N/mm
2,8
>1,8
Dielectric breakdown voltage, AC (1)
IPC-TM 650 2.5.6.3
kV
8
5
Proof Test, DC(2)
-
V
3000
3000
Thermal conductivity (dielectric layer)
ASTM-D 5470
w/m.°K
1,45
1,45
Thermal impedance {dielectric layer) x 10"
ä
ASTM-D 5470
°K.mVw
0,089
0,089
Surface resistance after damp heat and recovery
IEC-61189
M£2
10
5
10
5
Volume resistivity after damp heat and recovery
IEC-61189
MQm
10
4
10
4
Relative permittivity after damp heat and recovery, 10 kHz
IEC-61189
-
4,5
4,5
Dissipation factor after damp heat and recovery 10 kHz
IEC-61189
-
0,02
0,02
Capacitance
-
pF/cm
2
40
40
Flammability, according UL-94, class
UL-94
class
V-0
V-0
Glass transition temperature of dielectric layer ( by TMA)
IPC-TM 650-2.4.24
°c
90
90
Maximum operating temperature
-
°c
150
150
(1) Dielectric Breakdown test, is a material destructive laboratory lest. It is performed according to the IPC-TM-650 part
2.5.6.3., under AC voltage, raising it until electric failure.% on relative small surface area of the dielectric part, and using metal
2.5.6.3., under AC voltage, raising it until electric failure.% on relative small surface area of the dielectric part, and using metal
electrodes. Values should be taken as a material reference, and not as guaranteed values.
(2) Electrical proof test. 100% of our laminate production delivered has been "on line" verified at 2000 Vdc: 500 V/sec. ramp //
5sec. held at 2000 vdc.
Availability
Standard Sheet Size mm
530 x 610
Tolerance in mm
+5 / -0
Squareness in mm
3 mm max. as differential between diagonal measurement
Standard size tolerance in panels in mm
+ 0.3
Th data is based on typical values of standard production and should be considered as general information. Our company re-
serves the right to future changes. It is the responsibility of the user to ensure that the product complies with his requirements.
Cotherm ® is registered trademark of the Bungard GmbH & Co KG
Bungard Elektronik GmbH & Co. KG, Rilkestraße 1, 51570 Windeck – Germany
Tel.: +49 (0) 2292/5036, Fax: +49 (0) 2292/6175, E-mail: support@bungard.de