Intel 2.80 GHz BX80546KG2800EA Ficha De Dados
Códigos do produto
BX80546KG2800EA
Intel® Xeon™ Processor with 800 MHz System Bus
92
Datasheet
8.4
Thermal Specifications
This section describes the cooling requirements of the heatsink solution used by the boxed
processor.
processor.
8.4.1
Boxed Processor Cooling Requirements
As previously stated the boxed processor will be available in three product configurations. Each
configuration will require unique design considerations. Meeting the processor’s temperature
specifications is also the function of the thermal design of the entire system, and ultimately the
responsibility of the system integrator. The processor temperature specifications are found in
configuration will require unique design considerations. Meeting the processor’s temperature
specifications is also the function of the thermal design of the entire system, and ultimately the
responsibility of the system integrator. The processor temperature specifications are found in
of this document.
8.4.1.1
1U Passive CEK Heatsink (1U form factor)
In the 1U configuration it is assumed that a chassis duct will be implemented to provide 15 CFM of
airflow to pass through the heatsink fins. The duct should be designed as precisely as possible and
should not allow any air to bypass the heatsink (0” bypass) and a back pressure of 0.38 in. H
airflow to pass through the heatsink fins. The duct should be designed as precisely as possible and
should not allow any air to bypass the heatsink (0” bypass) and a back pressure of 0.38 in. H
2
O. It
is assumed that a 40 °C T
LA
is met. This requires a superior chassis design to limit the T
RISE
at or
below 5 °C with an external ambient temperature of 35 °C. Following these guidelines will allow
the designer to meet thermal profile B and conform to the thermal requirements of the processor.
the designer to meet thermal profile B and conform to the thermal requirements of the processor.
8.4.1.2
2U Passive CEK Heatsink (2U and above form factor)
Once again a chassis duct is required for the 2U passive heatsink. In this configuration Thermal
Profile A (see
Profile A (see
) should be followed by supplying 22 CFM of airflow through the fins of
the heatsink with a 0” or no duct bypass and a back pressure of 0.14 in. H
2
O. The T
LA
temperature
of 40 °C should be met. This may require the use of superior design techniques to keep T
RISE
at or
below 5 °C based on an ambient external temperature of 35 °C.
8.4.1.3
2U+ Active CEK Heatsink (2U+ and above pedestal)
This heatsink was designed to help pedestal chassis users to meet the thermal processor
requirements without the use of chassis ducting. It may be necessary to implement some form of
chassis air guide or air duct to meet the T
requirements without the use of chassis ducting. It may be necessary to implement some form of
chassis air guide or air duct to meet the T
LA
temperature of 40 °C depending on the pedestal
chassis layout. Also, while the active heatsink solution is designed to mechanically fit into a 2U
chassis, it may require additional space at the top of the heatsink to allow sufficient airflow into the
heatsink fan. Therefore, additional design criteria may need to be considered if this heatsink is used
in a 2U rack mount chassis, or in a chassis that has drive bay obstructions above the inlet to the fan
heatsink.
chassis, it may require additional space at the top of the heatsink to allow sufficient airflow into the
heatsink fan. Therefore, additional design criteria may need to be considered if this heatsink is used
in a 2U rack mount chassis, or in a chassis that has drive bay obstructions above the inlet to the fan
heatsink.
Thermal Profile A should be used to help determine the thermal performance of the platform.
Once again it is recommended that the ambient air temperature outside of the chassis be kept at or
below 35 °C. The air passing directly over the processor heatsink should not be preheated by other
system components. Meeting the processor’s temperature specification is the responsibility of the
system integrator.
below 35 °C. The air passing directly over the processor heatsink should not be preheated by other
system components. Meeting the processor’s temperature specification is the responsibility of the
system integrator.