Atmel Xplained Pro Evaluation Kit ATSAMD20-XPRO ATSAMD20-XPRO Ficha De Dados
Códigos do produto
ATSAMD20-XPRO
600
Atmel | SMART SAM D20 [DATASHEET]
Atmel-42129K–SAM-D20_datasheet–06/2014
33.
Packaging Information
33.1
Thermal Considerations
33.1.1 Thermal Resistance Data
summarizes the thermal resistance data depending on the package.
Table 33-1. Thermal Resistance Data
33.1.2 Junction Temperature
The average chip-junction temperature, T
J
, in °C can be obtained from the following equations:
Equation 1
Equation 2
where:
z
θ
JA
= package thermal resistance, Junction-to-ambient (°C/W), provided in
z
θ
JC
= package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in
z
θ
HEATSINK
= cooling device thermal resistance (°C/W), provided in the manufacturer datasheet
z
P
D
= device power consumption (W)
z
T
A
= ambient temperature (°C)
From
, the user can derive the estimated lifetime of the chip and decide if a cooling device is necessary or
should be used to compute the resulting average chip-
junction temperature T
J
in °C.
Package Type
θ
JA
θ
JC
32-pin TQFP
68
°C/W
25.8
°C/W
48-pin TQFP
78.8
°C/W
12.3
°C/W
64-pin TQFP
66.7
°C/W
11.9
°C/W
32-pin QFN
37.2
°C/W
3.1
°C/W
48-pin QFN
33
°C/W
11.4
°C/W
64-pin QFN
33.5
°C/W
11.2
°C/W
T
J
T
A
P
D
θ
JA
×
(
)
+
=
T
J
T
A
P
D
θ
HEATSINK
θ
JC
+
(
)
×
(
)
+
=