Atmel ATmega328P Xplained Mini MEGA328P-XMINI MEGA328P-XMINI Ficha De Dados
Códigos do produto
MEGA328P-XMINI
635
ATmega48A/PA/88A/PA/168A/PA/328/P [DATASHEET]
Atmel-8271H-AVR- ATmega-Datasheet_08/2014
39.2
32CC1
TITLE
DRAWING NO.
GPC
REV.
Package Drawing Contact:
packagedrawings@atmel.com
packagedrawings@atmel.com
B
CAG
32CC1, 32-ball (6 x 6 Array), 4 x 4 x 0.6 mm
package, ball pitch 0.50 mm, Ultra Thin,
Fine-Pitch Ball Grid Array (UFBGA)
package, ball pitch 0.50 mm, Ultra Thin,
Fine-Pitch Ball Grid Array (UFBGA)
32CC1
A – –
0.60
A1 0.12 – –
A2 0.38 REF
b 0.25
0.30
0.35
1
b1 0.25 – – 2
D 3.90
4.00
4.10
D1
2.50 BSC
E 3.90
4.00
4.10
E1
2.50 BSC
e
0.50 BSC
07/06/10
b1
COMMON DIMENSIONS
(Unit of Measure = mm)
1
2
3
4
5
6
B
A
A
C
D
E
F
E
D
e
32-Øb
E
D
B
A
Pin#1 ID
0.08
A1
A
D1
E1
A2
A1 BALL CORNER
1
2
3
4
5
6
F
C
SIDE VIEW
BOTTOM VIEW
TOP VIEW
SYMBOL
MIN
NOM
MAX
NOTE
Note1: Dimension “b” is measured at the maximum ball dia. in a plane parallel
to the seating plane.
Note2: Dimension “b1” is the solderable surface defined by the opening of the
solder resist layer.
e