STMicroelectronics 1.2 W fully differential audio power amplifier DEMOTS4995J DEMOTS4995J Ficha De Dados
Códigos do produto
DEMOTS4995J
TS4995
Package information
23/26
5 Package
information
T
o meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK
®
packages. These packages have a lead-free second level interconnect. The
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at:
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at:
www.st.com
.
Figure 59.
9-bump flip-chip package mechanical drawing
Figure 60.
Tape and reel schematics
1.63 mm
1.63 mm
0.5mm
0.5mm
∅
0.25mm
1.63 mm
1.63 mm
0.5mm
0.5mm
∅
0.25mm
600µm
600µm
– Die size: 1.63mm x 1.63mm ± 30µm
– Die height (including bumps): 600µm
– Bumps diameter: 315µm ±50µm
– Bump diameter before reflow: 300µm ±10µm
– Bumps height: 250µm ±40µm
– Die height: 350µm ±20µm
– Pitch: 500µm ±50µm
– Coplanarity: 60µm max
User direction of feed
A
1
A
1
8
Die size X + 70µm
Die siz
e
Y + 70µ
m
4
1.5
4
All dimensions are in mm
User direction of feed
A
1
A
1
8
Die size X + 70µm
Die siz
e
Y + 70µ
m
4
1.5
4
All dimensions are in mm