Intel 4 519K HH80547PE0831MN Ficha De Dados
Códigos do produto
HH80547PE0831MN
Datasheet
35
Package Mechanical Specifications
3.1.2
Processor Component Keep-out Zones
The processor may contain components on the substrate that define component keep-out zone
requirements. A thermal and mechanical solution design must not intrude into the required keep-
out zones. Decoupling capacitors are typically mounted to either the topside or pin-side of the
package substrate. See
requirements. A thermal and mechanical solution design must not intrude into the required keep-
out zones. Decoupling capacitors are typically mounted to either the topside or pin-side of the
package substrate. See
for keep-out zones.
The location and quantity of package capacitors may change due to manufacturing efficiencies but
will remain within the component keep-in.
will remain within the component keep-in.
3.1.3
Package Loading Specifications
provides dynamic and static load specifications for the processor package. These
mechanical maximum load limits should not be exceeded during heatsink assembly, shipping
conditions, or standard use condition. Also, any mechanical system or component testing should
not exceed the maximum limits. The processor package substrate should not be used as a
mechanical reference or load-bearing surface for thermal and mechanical solution. The minimum
loading specification must be maintained by any thermal and mechanical solutions.
conditions, or standard use condition. Also, any mechanical system or component testing should
not exceed the maximum limits. The processor package substrate should not be used as a
mechanical reference or load-bearing surface for thermal and mechanical solution. The minimum
loading specification must be maintained by any thermal and mechanical solutions.
.
3.1.4
Package Handling Guidelines
includes a list of guidelines on package handling in terms of recommended maximum
loading on the processor IHS relative to a fixed substrate. These package handling loads may be
experienced during heatsink removal.
experienced during heatsink removal.
Table 20. Processor Loading Specifications
Parameter
Minimum
Maximum
Notes
Static
44 N [10 lbf]
445 N [100 lbf]
1, 2, 3
NOTES:
1.
These specifications apply to uniform compressive loading in a direction normal to the processor IHS.
2.
This is the maximum force that can be applied by a heatsink retention clip. The clip must also provide the
minimum specified load on the processor package.
minimum specified load on the processor package.
3.
These specifications are based on limited testing for design characterization. Loading limits are for the pack-
age only and does not include the limits of the processor socket.
age only and does not include the limits of the processor socket.
Dynamic
890 N [200 lbf]
4.
Dynamic loading is defined as an 11 ms duration average load superimposed on the static load requirement.
Transient
667 N [150 lbf]
5.
Transient loading is defined as a 2 second duration peak load superimposed on the static load requirement,
representative of loads experienced by the package during heatsink installation.
representative of loads experienced by the package during heatsink installation.
Table 21. Package Handling Guidelines
Parameter
Maximum Recommended
Notes
Shear
356 N [80 lbf]
1, 2
NOTES:
1.
A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.
2.
These guidelines are based on limited testing for design characterization.
Tensile
156 N [35 lbf]
3.
A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface.
Torque
8 N-m [70 lbf-in]
4.
A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top sur-
face.
face.