Intel C2350 FH8065401488914 Ficha De Dados
Códigos do produto
FH8065401488914
Volume 2—Thermal Management—C2000 Product Family
Overview
Intel
®
Atom™ Processor C2000 Product Family for Microserver
Datasheet, Vol. 2 of 3
September 2014
144
Order Number: 330061-002US
8
Thermal Management
8.1
Overview
The SoC implements configurable forms of thermal management for itself, memory,
and the system. The architecture implements various proven methods of maintaining
maximum performance while remaining within thermal specifications. Thermal Control
Circuit (TCC) mechanisms are used to reduce power consumption when thermal device
limits are exceeded and the system is notified of this condition via interrupts or thermal
signaling pins.
Thermal management features include:
• Up to 15 Digital Thermal Sensors (DTS) per SoC
— Three sensors per two-core module
— Three uncore sensors
— Three uncore sensors
• Four (4) thermal interrupt triggers per sensor
— Hot, critical, and two programmable thresholds
• PROCHOT_B, MEMHOT_B, and THERMTRIP_N
• Thermal Control Circuit (TCC) mechanisms
• Thermal Control Circuit (TCC) mechanisms
— Bi-directional PROCHOT_B
— Intel
— Intel
®
Thermal Monitor 1
— Intel
®
Thermal Monitor 2
• Thermal monitoring and actions managed by the SoC
• Closed-Loop Thermal Throttling (CLTT) pass-through
• Temperature provided by the BMC or other external circuitry via PECI over SMBus
• Memory thermal control
• Fan Speed Control (FSC) parameter (T
• Closed-Loop Thermal Throttling (CLTT) pass-through
• Temperature provided by the BMC or other external circuitry via PECI over SMBus
• Memory thermal control
• Fan Speed Control (FSC) parameter (T
control
)
The functional description for PECI over the integrated SMBus is in
Table 8-1.
References
Reference
Revision
Date
Document Title
ACPI
Specification
5.0
December 6,
2011
Advanced Configuration and Power Interface Specification
,
Revision 5.0