Intel X5272 AT80573KL0966M Ficha De Dados

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AT80573KL0966M

Dual-Core Intel® Xeon® Processor 5200 Series Datasheet

6.2.1

Intel

Thermal Monitor Features...............................................................85

6.2.2

On-Demand Mode...................................................................................87

6.2.3

PROCHOT# Signal ..................................................................................88

6.2.4

FORCEPR# Signal ...................................................................................88

6.2.5

THERMTRIP# Signal ................................................................................88

6.3

Platform Environment Control Interface (PECI) ......................................................89
6.3.1

Introduction...........................................................................................89

6.3.2

PECI Specifications .................................................................................90

Features ..................................................................................................................93
7.1

Power-On Configuration Options ..........................................................................93

7.2

Clock Control and Low Power States.....................................................................93
7.2.1

Normal State .........................................................................................94

7.2.2

HALT or Extended HALT State...................................................................94

7.2.3

Stop-Grant State ....................................................................................96

7.2.4

Extended HALT Snoop or HALT Snoop State,

Stop Grant Snoop State...........................................................................96

7.3

Enhanced Intel SpeedStep® Technology...............................................................97

Boxed Processor Specifications................................................................................99
8.1

Introduction......................................................................................................99

8.2

Mechanical Specifications.................................................................................. 101
8.2.1

Boxed Processor Heat Sink Dimensions (CEK)........................................... 101

8.2.2

Boxed Processor Heat Sink Weight .......................................................... 109

8.2.3

Boxed Processor Retention Mechanism and Heat Sink

Support (CEK)...................................................................................... 109

8.3

Electrical Requirements .................................................................................... 109
8.3.1

Fan Power Supply (Active CEK)............................................................... 109

8.3.2

Boxed Processor Cooling Requirements.................................................... 110

8.4

Boxed Processor Contents................................................................................. 111

Debug Tools Specifications .................................................................................... 113
9.1

Debug Port System Requirements ...................................................................... 113

9.2

Target System Implementation.......................................................................... 113
9.2.1

System Implementation......................................................................... 113

9.3

Logic Analyzer Interface (LAI) ........................................................................... 113
9.3.1

Mechanical Considerations ..................................................................... 114

9.3.2

Electrical Considerations ........................................................................ 114