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BX80574X5450

Quad-Core Intel® Xeon® Processor 5400 Series Datasheet

Contents

Introduction ..............................................................................................................9
1.1

Terminology ..................................................................................................... 10

1.2

State of Data .................................................................................................... 13

1.3

References ....................................................................................................... 13

Quad-Core Intel® Xeon® Processor 5400 Series Electrical Specifications................ 15
2.1

Front Side Bus and GTLREF ................................................................................ 15

2.2

Power and Ground Lands.................................................................................... 16

2.3

Decoupling Guidelines........................................................................................ 16
2.3.1

VCC

Decoupling...................................................................................... 16

2.3.2

VTT

Decoupling ...................................................................................... 16

2.3.3

Front Side Bus AGTL+ Decoupling ............................................................ 16

2.4

Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ....................................... 17
2.4.1

Front Side Bus Frequency Select Signals (BSEL[2:0]) .................................. 17

2.4.2

PLL Power Supply ................................................................................... 18

2.5

Voltage Identification (VID) ................................................................................ 18

2.6

Reserved, Unused, and Test Signals..................................................................... 21

2.7

Front Side Bus Signal Groups.............................................................................. 22

2.8

CMOS Asynchronous and Open Drain Asynchronous Signals .................................... 24

2.9

Test Access Port (TAP) Connection....................................................................... 24

2.10 Platform Environmental Control Interface (PECI) DC Specifications........................... 24

2.10.1 DC Characteristics .................................................................................. 24
2.10.2 Input Device Hysteresis .......................................................................... 25

2.11 Mixing Processors.............................................................................................. 26
2.12 Absolute Maximum and Minimum Ratings ............................................................. 26
2.13 Processor DC Specifications ................................................................................ 27

2.13.1 Flexible Motherboard Guidelines (FMB) ...................................................... 27
2.13.2 VCC Overshoot Specification .................................................................... 38
2.13.3 Die Voltage Validation ............................................................................. 39

2.14 AGTL+ FSB Specifications................................................................................... 39

Mechanical Specifications ........................................................................................ 43
3.1

Package Mechanical Drawings ............................................................................. 43

3.2

Processor Component Keepout Zones................................................................... 47

3.3

Package Loading Specifications ........................................................................... 47

3.4

Package Handling Guidelines............................................................................... 48

3.5

Package Insertion Specifications.......................................................................... 48

3.6

Processor Mass Specifications ............................................................................. 48

3.7

Processor Materials............................................................................................ 48

3.8

Processor Markings............................................................................................ 48

3.9

Processor Land Coordinates ................................................................................ 49

Land Listing............................................................................................................. 51
4.1

Quad-Core Intel® Xeon® Processor 5400 Series Pin Assignments ........................... 51
4.1.1

Land Listing by Land Name...................................................................... 51

4.1.2

Land Listing by Land Number ................................................................... 61

Signal Definitions .................................................................................................... 71
5.1

Signal Definitions .............................................................................................. 71

Thermal Specifications ............................................................................................ 79
6.1

Package Thermal Specifications........................................................................... 79
6.1.1

Thermal Specifications ............................................................................ 79

6.1.2

Thermal Metrology ................................................................................. 90

6.2

Processor Thermal Features ................................................................................ 90