Intel Xeon X3470 BX80605X3470 Manual Do Utilizador

Códigos do produto

BX80605X3470

Intel® Xeon® Processor 3400 Series Datasheet, Volume 1

Contents

Introduction ..............................................................................................................9
1.1

Processor Feature Details ................................................................................... 11
1.1.1

Supported Technologies .......................................................................... 11

1.2

Interfaces ........................................................................................................ 12
1.2.1

System Memory Support ......................................................................... 12

1.2.2

PCI Express* ......................................................................................... 13

1.2.3

Direct Media Interface (DMI).................................................................... 14

1.2.4

Platform Environment Control Interface (PECI)........................................... 14

1.3

Power Management Support ............................................................................... 15
1.3.1

Processor Core....................................................................................... 15

1.3.2

System ................................................................................................. 15

1.3.3

Memory Controller.................................................................................. 15

1.3.4

PCI Express* ......................................................................................... 15

1.4

Thermal Management Support ............................................................................ 15

1.5

Package ........................................................................................................... 15

1.6

Terminology ..................................................................................................... 16

1.7

Interfaces................................................................................................................ 19
2.1

System Memory Interface .................................................................................. 19
2.1.1

System Memory Technology Supported ..................................................... 19

2.1.2

System Memory Timing Support............................................................... 20

2.1.3

System Memory Organization Modes......................................................... 20
2.1.3.1

Single-Channel Mode................................................................. 20

2.1.3.2

Dual-Channel Mode — Intel

Flex Memory Technology Mode .......... 21

2.1.4

Rules for Populating Memory Slots............................................................ 22

2.1.5

Technology Enhancements of Intel

Fast Memory Access (Intel

FMA).......... 23

2.1.5.1

Just-in-Time Command Scheduling.............................................. 23

2.1.5.2

Command Overlap .................................................................... 23

2.1.5.3

Out-of-Order Scheduling ............................................................ 23

2.1.6

System Memory Pre-Charge Power Down Support Details ............................ 23

2.2

PCI Express* Interface....................................................................................... 24
2.2.1

PCI Express* Architecture ....................................................................... 24
2.2.1.1

Transaction Layer ..................................................................... 25

2.2.1.2

Data Link Layer ........................................................................ 25

2.2.1.3

Physical Layer .......................................................................... 25

2.2.2

PCI Express* Configuration Mechanism ..................................................... 26

2.2.3

PCI Express* Ports and Bifurcation ........................................................... 26
2.2.3.1

PCI Express* Bifurcated Mode .................................................... 27

2.3

Direct Media Interface (DMI)............................................................................... 27
2.3.1

DMI Error Flow....................................................................................... 27

2.3.2

Processor/PCH Compatibility Assumptions.................................................. 27

2.3.3

DMI Link Down ...................................................................................... 27

2.4

Platform Environment Control Interface (PECI)...................................................... 28

2.5

Interface Clocking ............................................................................................. 28
2.5.1

Internal Clocking Requirements................................................................ 28

Technologies ........................................................................................................... 29
3.1

Intel

Virtualization Technology .......................................................................... 29

3.1.1

Intel

VT-x Objectives ............................................................................ 29

3.1.2

Intel

VT-x Features .............................................................................. 29