Intel Xeon X3440 BX80605X3440 Manual Do Utilizador
Códigos do produto
BX80605X3440
1U Collaboration Thermal Solution
64
8.4
Geometric Envelope for 1U Thermal Mechanical
Design
8.5
Thermal Interface Material
A thermal interface material (TIM) provides conductivity between the IHS and heatsink.
The collaboration thermal solution uses Honeywell PCM45F, which pad size is
35x35 mm.
The collaboration thermal solution uses Honeywell PCM45F, which pad size is
35x35 mm.
TIM should be verified to be within its recommended shelf life before use. Surfaces
should be free of foreign materials prior to application of TIM.
should be free of foreign materials prior to application of TIM.
§
Figure 8-4. KOZ 3-D Model (Top) in 1U Server
2.5mm Maximum
Component Height
(6 places)
Component Height
(6 places)
1.2mm Maximum
Component Height
(1 place)
Component Height
(1 place)
1.6mm Maximum
Component Height
(2 places)
Component Height
(2 places)
9.5mm Maximum
Component Height
(5 places)
Component Height
(5 places)
2.07mm Maximum
Component Height
(1 place)
Component Height
(1 place)