Intel 4 551 BX80547PG3400EK Manual Do Utilizador

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•

Retention mechanism (RM)—Since the LGA775 socket does not include any mechanical 
features for heatsink attach, a retention mechanism is required. Component thermal solutions 
should attach to the processor via a retention mechanism that is independent of the socket.

•

Storage conditions—Refers to a non-operational state. The processor may be installed in a 
platform, in a tray, or loose. Processors may be sealed in packaging or exposed to free air. 
Under these conditions, processor lands should not be connected to any supply voltages, have 
any I/Os biased, or receive any clocks. Upon exposure to “free air” (i.e., unsealed packaging or 
a device removed from packaging material) the processor must be handled in accordance with 
moisture sensitivity labeling (MSL) as indicated on the packaging material.

•

Functional operation—Refers to normal operating conditions in which all processor 
specifications, including DC, AC, system bus, signal quality, mechanical and thermal, are 
satisfied. 

Material and concepts available in the following documents may be beneficial when reading this 
document.

§

http://developer.intel.com/
design/Pentium4/
specupdt/302352.htm

http://developer.intel.com/
design/Pentium4/guides/
302553.htm

http://developer.intel.com/
design/Pentium4/guides/
302356.htm

http://developer.intel.com/
design/pentium4/
manuals/index_new.htm

IA-32 Intel

®

 Architecture Software Developer's Manual Volume 1: Basic 

Architecture

http://developer.intel.com/
design/pentium4/
manuals/index_new.htm