Manuais de utilizador para Intel 0.9

índice analítico

• Intel ATX Power Supply Design Guide

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• Disclaimer

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• Revision History

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• Contents

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• 1. Scope

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• 2. Applicable Documents

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• 3. Electrical Specification

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  • 3.1 AC Input Requirements

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    • 3.1.1 Input Overcurrent Protection

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    • 3.1.2 Inrush Current Limiting

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    • 3.1.3 Input Undervoltage

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    • 3.1.4 Immunity

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      • 3.1.4.1 Slow Transients

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      • 3.1.4.2 Surge Voltages

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        • 3.1.4.2.1 Surge Immunity, IEC801-5/IEC1000-4-5

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        • 3.1.4.2.2 Electrical Fast Transient / Burst, IEC801-4/IEC1000-4-4

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        • 3.1.4.2.3 Ring Wave, ANSI C62.45-1992

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        • 3.1.4.2.4 Electrostatic Discharge, IEC801-2/IEC1000-4-2

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      • 3.1.4.3 Radiated Immunity

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        • 3.1.4.3.1 IEC801-3/IEC1000-4-3

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        • 3.1.4.3.2 ENV 50140

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        • 3.1.4.3.3 Radio Frequency Common Mode, ENV 50141

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    • 3.1.5 Catastrophic Failure Protection

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  • 3.2 DC Output Requirements

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    • 3.2.1 DC Voltage Regulation

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    • 3.2.2 Remote Sensing

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  • 3.3 Typical Power Distribution

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    • 3.3.1 Power Limit

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    • 3.3.2 Efficiency

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    • 3.3.3 Output Ripple/Noise

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    • 3.3.4 Output Transient Response

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    • 3.3.5 Capacitive Load

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    • 3.3.6 Closed Loop Stability

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    • 3.3.7 +5VDC/+3.3VDC Power Sequencing

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    • 3.3.8 Voltage Hold-up Time

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  • 3.4 Timing / Housekeeping Control

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    • 3.4.1 PWR_OK

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    • 3.4.2 PS_ON#

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    • 3.4.3 +5VSB

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    • 3.4.4 Power-on Time

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    • 3.4.5 Risetime

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    • 3.4.6 Overshoot at Turn-on/Turn-off

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    • 3.4.7 Reset after Shutdown

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    • 3.4.8 +5VSB at AC Power Down

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  • 3.5 Output Protection

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    • 3.5.1 Overvoltage Protection

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    • 3.5.2 Short Circuit Protection

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    • 3.5.3 No Load Operation

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    • 3.5.4 Overcurrent Protection

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    • 3.5.5 Output Bypass

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• 4. Mechanical Requirements

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  • 4.1 Labeling / Marking

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  • 4.2 Physical Dimensions

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  • 4.3 Airflow / Fan

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  • 4.4 AC Connector

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  • 4.5 DC Connectors

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    • 4.5.1 ATX Main Power Connector

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    • 4.5.2 Auxiliary Power Connector

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    • 4.5.3 Peripheral Connector(s)

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    • 4.5.4 Floppy Drive Connector

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• 5. Environmental Requirements

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  • 5.1 Temperature

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  • 5.2 Thermal Shock (Shipping)

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  • 5.3 Humidity

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  • 5.4 Altitude

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  • 5.5 Mechanical Shock

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  • 5.6 Random Vibration

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  • 5.7 Acoustics

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• 6. Electromagnetic Compatibility

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  • 6.1 EMI

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  • 6.2 Input Line Current Harmonic Content (Optional)

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  • 6.3 Magnetic Leakage Fields

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• 7. Reliability

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  • 7.1 Component Derating

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  • 7.2 Mean Time Between Failures (MTBF)

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• 8. Safety Requirements

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  • 8.1 North America

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  • 8.2 International

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  • 8.3 Proscribed Materials

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