Manual Do Utilizador (LE80539LF0212M)índice analíticoContents31 Introduction71.1 Terminology91.2 References92 Low Power Features112.1 Clock Control and Low Power States112.1.1 Core Low-Power States132.1.1.1 C0 State132.1.1.2 C1/AutoHALT Powerdown State132.1.1.3 C1/MWAIT Powerdown State132.1.1.4 Core C2 State132.1.1.5 Core C3 State142.1.1.6 Core C4 State142.1.2 Package Low Power States142.1.2.1 Normal State142.1.2.2 Stop-Grant State142.1.2.3 Stop Grant Snoop State152.1.2.4 Sleep State152.1.2.5 Deep Sleep State162.1.2.6 Deeper Sleep State162.2 Enhanced Intel SpeedStep® Technology172.3 Extended Low Power States182.4 FSB Low Power Enhancements192.5 Processor Power Status Indicator (PSI#) Signal193 Electrical Specifications213.1 Power and Ground Pins213.2 FSB Clock (BCLK[1:0]) and Processor Clocking213.3 Voltage Identification213.4 Catastrophic Thermal Protection243.5 Signal Terminations and Unused Pins253.6 FSB Frequency Select Signals (BSEL[2:0])253.7 FSB Signal Groups253.8 CMOS Signals273.9 Maximum Ratings273.10 Processor DC Specifications284 Package Mechanical Specifications and Pin Information414.1 Package Mechanical Specifications414.1.1 Package Mechanical Drawings414.1.2 Processor Component Keep-Out Zones464.1.3 Package Loading Specifications464.1.4 Processor Mass Specifications464.2 Processor Pinout and Pin List474.3 Alphabetical Signals Reference495 Thermal Specifications and Design Considerations795.1 Thermal Specifications855.1.1 Thermal Diode855.1.2 Thermal Diode Offset875.1.3 Intel® Thermal Monitor875.1.4 Digital Thermal Sensor (DTS)895.1.5 Out of Specification Detection905.1.6 PROCHOT# Signal Pin90Tamanho: 2 MBPáginas: 91Language: EnglishAbrir o manual
