Ficha De Dados (AT80569KJ080N)índice analítico1 Introduction91.1 Terminology91.1.1 Processor Terminology101.2 References112 Electrical Specifications132.1 Power and Ground Lands132.2 Decoupling Guidelines132.2.1 VCC Decoupling132.2.2 Vtt Decoupling132.2.3 FSB Decoupling142.3 Voltage Identification142.4 Market Segment Identification (MSID)162.5 Reserved, Unused, and TESTHI Signals162.6 Voltage and Current Specification172.6.1 Absolute Maximum and Minimum Ratings172.6.2 DC Voltage and Current Specification182.6.3 VCC Overshoot222.6.4 Die Voltage Validation222.7 Signaling Specifications232.7.1 FSB Signal Groups232.7.2 CMOS and Open Drain Signals252.7.3 Processor DC Specifications252.7.4 Clock Specifications272.7.5 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking272.7.6 FSB Frequency Select Signals (BSEL[2:0])282.7.7 Phase Lock Loop (PLL) and Filter282.7.8 BCLK[1:0] Specifications (CK505 based Platforms)292.7.9 BCLK[1:0] Specifications (CK410 based Platforms)302.8 PECI DC Specifications313 Package Mechanical Specifications333.1 Package Mechanical Drawing343.1.1 Processor Component Keep-Out Zones383.1.2 Package Loading Specifications383.1.3 Package Handling Guidelines383.1.4 Package Insertion Specifications383.1.5 Processor Mass Specification393.1.6 Processor Materials393.2 Processor Markings393.2.1 Processor Land Coordinates414 Land Listing and Signal Descriptions434.1 Processor Land Assignments434.2 Alphabetical Signals Reference665 Thermal Specifications and Design Considerations735.1 Processor Thermal Specifications735.1.1 Thermal Specifications735.1.2 Thermal Metrology785.2 Processor Thermal Features785.2.1 Thermal Monitor785.2.2 Thermal Monitor 2795.2.3 On-Demand Mode805.2.4 PROCHOT# Signal815.2.5 THERMTRIP# Signal815.3 Thermal Diode815.4 Platform Environment Control Interface (PECI)835.4.1 Introduction835.4.2 PECI Specifications866 Features876.1 Power-On Configuration Options876.2 Clock Control and Low Power States876.2.1 Normal State886.2.2 HALT and Extended HALT Powerdown States886.2.3 Stop Grant and Extended Stop Grant States896.2.4 Extended HALT Snoop State, HALT Snoop State, Extended Stop Grant Snoop State, and Stop Grant Snoop State906.3 Enhanced Intel® SpeedStep® Technology917 Boxed Processor Specifications937.1 Mechanical Specifications947.1.1 Boxed Processor Cooling Solution Dimensions947.1.2 Boxed Processor Fan Heatsink Weight957.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly957.2 Electrical Requirements957.2.1 Fan Heatsink Power Supply957.3 Thermal Specifications977.3.1 Boxed Processor Cooling Requirements977.3.2 Variable Speed Fan998 Debug Tools Specifications1018.1 Logic Analyzer Interface (LAI)1018.1.1 Mechanical Considerations1018.1.2 Electrical Considerations101Tamanho: 2 MBPáginas: 102Language: EnglishAbrir o manual
Ficha De Dados (INXEON3370)índice analíticoQuad-Core Intel® Xeon® Processor13300 Series1Contents3Figures4Tables5Revision History6Quad-Core Intel® Xeon® Processor 3300 Series Features71 Introduction91.1 Terminology91.1.1 Processor Terminology Definitions101.2 References112 Electrical Specifications132.1 Power and Ground Lands132.2 Decoupling Guidelines132.2.1 Vcc Decoupling132.2.2 Vtt Decoupling132.2.3 FSB Decoupling132.3 Voltage Identification142.4 Reserved, Unused, and TESTHI Signals162.5 Flexible Motherboard Guidelines (FMB)162.6 Power Segment Identifier (PSID)172.7 Voltage and Current Specification172.7.1 Absolute Maximum and Minimum Ratings172.7.2 DC Voltage and Current Specification182.7.3 VCC Overshoot212.7.4 Die Voltage Validation222.8 Signaling Specifications222.8.1 FSB Signal Groups222.8.2 CMOS and Open Drain Signals242.8.3 Processor DC Specifications242.8.3.1 Platform Environment Control Interface (PECI) DC Specifications262.8.3.2 GTL+ Front Side Bus Specifications262.9 Clock Specifications282.9.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking282.9.2 FSB Frequency Select Signals (BSEL[2:0])282.9.3 Phase Lock Loop (PLL) and Filter292.9.4 BCLK[1:0] Specifications303 Package Mechanical Specifications333.1 Package Mechanical Specifications333.1.1 Package Mechanical Drawing343.1.2 Processor Component Keep-Out Zones383.1.3 Package Loading Specifications383.1.4 Package Handling Guidelines383.1.5 Package Insertion Specifications393.1.6 Processor Mass Specification393.1.7 Processor Materials393.1.8 Processor Markings393.1.9 Processor Land Coordinates404 Land Listing and Signal Descriptions414.1 Processor Land Assignments414.2 Alphabetical Signals Reference645 Thermal Specifications and Design Considerations755.1 Processor Thermal Specifications755.1.1 Thermal Specifications755.1.2 Thermal Metrology805.2 Processor Thermal Features805.2.1 Thermal Monitor805.2.2 Thermal Monitor 2815.2.3 On-Demand Mode825.2.4 PROCHOT# Signal835.2.5 THERMTRIP# Signal835.3 Platform Environment Control Interface (PECI)835.3.1 Introduction835.3.1.1 TCONTROL and TCC activation on PECI-Based Systems845.3.2 PECI Specifications845.3.2.1 PECI Device Address845.3.2.2 PECI Command Support845.3.2.3 PECI Fault Handling Requirements845.3.2.4 PECI GetTemp0() Error Code Support856 Features876.1 Power-On Configuration Options876.2 Clock Control and Low Power States876.2.1 Normal State886.2.2 HALT and Extended HALT Powerdown States886.2.2.1 HALT Powerdown State886.2.2.2 Extended HALT Powerdown State896.2.3 Stop Grant State896.2.4 Extended HALT Snoop or HALT Snoop State, Stop Grant Snoop State896.2.4.1 HALT Snoop State, Stop Grant Snoop State906.2.4.2 Extended HALT Snoop State906.2.5 Enhanced Intel SpeedStep® Technology906.2.6 Processor Power Status Indicator (PSI) Signal907 Boxed Processor Specifications917.1 Introduction917.2 Mechanical Specifications927.2.1 Boxed Processor Cooling Solution Dimensions927.2.2 Boxed Processor Fan Heatsink Weight947.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly947.3 Electrical Requirements947.3.1 Fan Heatsink Power Supply947.4 Thermal Specifications967.4.1 Boxed Processor Cooling Requirements967.4.2 Variable Speed Fan988 Debug Tools Specifications1018.1 Logic Analyzer Interface (LAI)1018.1.1 Mechanical Considerations1018.1.2 Electrical Considerations101Tamanho: 1 MBPáginas: 102Language: EnglishAbrir o manual
