Manuais de utilizador para Shanghai MXCHIP Information Technology Co. Ltd. EMW3239

índice analítico

• User Manual of EMW3239

  1
• Version Record

  1
• Introduction

  4
• Considerations in Hardware Design

  6
• MECHANICAL SIZE

  6
• REFERENCE PACKAGE DESIGN

  6
• DC POWER DESIGN

  7
• PIN FUNCTION

  7
• RF DESIGN

  9
• 2.5.1 On-board PCB Antenna Design

  9
• 2.5.2 External Antenna

  10
• ESD DESIGN

  11
• Downloading Firmware and Storage Test Method

  12
• PREPARATIONS

  12
• SWITCH SET UP IN DOWNLOADING MODE

  12
• SYSTEM CONNECTION

  13
• SERIAL PORT SELECTION

  13
• J-FLASH

  13
• J-FLASH SET UP

  14
• TESTING

  15
• 3.7.1 Environment Set Up

  15
• IMPORTANT STATEMENT

  16
• SMT

  17
• STENCILS

  17
• TEMPERATURE CURVE OF SECONDARY REFLOW

  17
• Mass Production Test and Product Update

  18
• MODULE TEST

  18
• 5.1.1 Half Secondary Development of Firmware

  18
• 5.1.2 Complete Secondary Development of Firmware

  18
• PRODUCT UPDATE

  18
• Technical Support

  19
• FCC Statement

  20
• Figure 1.1 Top View of EMW3239-P

  4
• Figure 1.2 Top View of EMW3239-E

  4
• Figure 2.1 Top View of Mechanical Size

  6
• Figure 2.2 Side View of Mechanical Size

  6
• Figure 2.3 SMT Package

  7
• Figure 2.4 PCB Design

  9
• Figure 2.5 Minimum PCB Clearance Area

  10
• Figure 2.6 Position of the Module

  10
• Figure 2.7 Size of External Antenna

  11
• Figure 3.1Switch Set Up

  13
• Figure 3.2Power Light

  13
• Figure 3.3 Name in Device Manager

  13
• Figure 3.4 Install J-Flash

  14
• Figure 3.5 J-Flash signature

  14
• Figure 3.6 Target Interface Set Up

  14
• Figure 3.7 MCU Set Up

  15
• Figure 3.8 Production Set Up

  15
• Figure 3.9 Position of Routers

  16
• Figure 4.1 Stencils size

  17
• Figure 4.2 Temperature Curve of Secondary Reflow

  17
• Table 2.1 Switch Mode

  7
• Table 3.1Device List

  12
• Table 3.2Download Websites

  12