Справочник Пользователя для Intel DH57JG LGA-1156 mini-ITX DDR3 1333/1066 MHz 8GB BOXDH57JG
Модели
BOXDH57JG
Intel Desktop Board DH57JG Technical Product Specification
58
2.7
Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability
Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF
prediction is used to estimate repair rates and spare parts requirements.
subassembly random failure rates. The calculation is based on the Bellcore Reliability
Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF
prediction is used to estimate repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 50 ºC. The MTBF for the board is
158,918 hours.
158,918 hours.
2.8
Environmental
Table 32 lists the environmental specifications for the board.
Table 32. Environmental Specifications
Parameter Specification
Temperature
Non-Operating -40
°C to +60 °C
Operating
0 °C to +40 °C
Shock
Unpackaged
50 g trapezoidal waveform
Velocity change of 170 inches/second²
Packaged
Half sine 2 millisecond
Product Weight (pounds)
Free Fall (inches)
Velocity Change (inches/sec²)
<20
36
167
21-40
30
152
41-80
24
136
81-100
18
118
Vibration
Unpackaged
5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz: 0.02 g² Hz (flat)
Packaged
5 Hz to 40 Hz: 0.015 g² Hz (flat)
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz