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Intel® Server Boards S5520HC and S5500HCV TPS 
Design and Environmental Specifications 
Revision 1.2 
   
Intel order number E39529-009 
127
 
9.  Design and Environmental Specifications 
9.1 Intel
®
 Server Boards S5520HC and S5500HCV Design 
Specifications 
Operation of the Intel
®
 Server Boards S5520HC and/or S5500HCV at conditions beyond those 
shown in the following table may cause permanent damage to the system. Exposure to absolute 
maximum rating conditions for extended periods may affect system reliability. 
Table 70. Server Board Design Specifications 
Operating Temperature  
0º C to 55º C 1 (32º F to 131º F) 
Non-Operating Temperature 
-40º C to 70º C (-40º F to 158º F) 
DC Voltage 
± 5% of all nominal voltages 
Shock (Unpackaged) 
Trapezoidal, 50 G, 170 inches / sec 
Shock (Packaged)  
< 20 pounds 
20 to < 40 pounds 
40 to < 80 pounds 
80 to < 100 pounds 
100 to < 120 pounds 
120 pounds  
 
36 inches 
30 inches 
24 inches 
18 inches 
12 inches 
9 inches 
Vibration (Unpackaged) 
5 Hz to 500 Hz 3.13 g RMS random 
Note: 
1
 Chassis design must provide proper airflow to avoid exceeding the processor maximum case 
temperature
Disclaimer Note
: Intel Corporation server boards contain a number of high-density VLSI and 
power delivery components that need adequate airflow to cool. Intel ensures through its own 
chassis development and testing that when Intel
®
 server building blocks are used together, the 
fully integrated system will meet the intended thermal requirements of these components. It is 
the responsibility of the system integrator who chooses not to use Intel
®
 developed server 
building blocks to consult vendor datasheets and operating parameters to determine the amount 
of airflow required for their specific application and environmental conditions. Intel Corporation 
cannot be held responsible, if components fail or the server board does not operate correctly 
when used outside any of its published operating or non-operating limits. 
9.2 MTBF 
The following is the calculated Mean Time Between Failures (MTBF) 30
 C (ambient air). These 
values are derived using a historical failure rate and multiplied by factors for application, 
electrical and/or thermal stress and for device maturity. You should view MTBF estimates as 
“reference numbers” only. 
  Calculation Model: Telcordia Issue 1, method I case 3 
  Operating Temperature: Server in 30° C ambient air