Справочник Пользователя для Intel SL2YM

3

1.0

Introduction......................................................................................................................... 7

1.1

Terminology........................................................................................................... 8
1.1.1

S.E.C. Cartridge Terminology .................................................................. 8

1.2

References ............................................................................................................ 9

2.0

Electrical Specifications.................................................................................................... 10

2.1

Processor System Bus and VREF ...................................................................... 10

2.2

Clock Control and Low Power States ..................................................................11
2.2.1

Normal State—State 1 ........................................................................... 12

2.2.2

AutoHALT Powerdown State—State 2................................................... 12

2.2.3

Stop-Grant State—State 3 ..................................................................... 12

2.2.4

HALT/Grant Snoop State—State 4 ........................................................ 13

2.2.5

Sleep State—State 5 ..............................................................................13

2.2.6

Deep Sleep State—State 6 .................................................................... 13

2.2.7

Clock Control ..........................................................................................14

2.3

Power and Ground Pins ...................................................................................... 14

2.4

Decoupling Guidelines ........................................................................................ 14
2.4.1

Processor VCC

CORE 

Decoupling............................................................ 15

2.4.2

Processor System Bus AGTL+ Decoupling............................................ 15

2.5

Processor System Bus Clock and Processor Clocking ....................................... 15
2.5.1

Mixing Processors of Different Frequencies........................................... 15

2.6

Voltage Identification ........................................................................................... 15

2.7

Processor System Bus Unused Pins................................................................... 17

2.8

Processor System Bus Signal Groups ................................................................ 17
2.8.1

Asynchronous vs. Synchronous for System Bus Signals ....................... 19

2.8.2

System Bus Frequency Select Signal (100/66#) .................................... 19

2.9

Test Access Port (TAP) Connection.................................................................... 20

2.10

Maximum Ratings................................................................................................ 20

2.11

Processor DC Specifications............................................................................... 21

2.12

AGTL+ System Bus Specifications ..................................................................... 24

2.13

System Bus AC Specifications ............................................................................ 25

3.0

System Bus Signal Simulations........................................................................................ 36

3.1

System Bus Clock (BCLK) Signal Quality Specifications and Measurement 
Guidelines ........................................................................................................... 37

3.2

AGTL+ Signal Quality Specifications and Measurement Guidelines .................. 38

3.3

Non-AGTL+ Signal Quality Specifications and Measurement Guidelines........... 40
3.3.1

Overshoot/Undershoot Guidelines ......................................................... 41

3.3.2

Ringback Specification ........................................................................... 41

3.3.3

Settling Limit Guideline........................................................................... 42

4.0

Thermal Specifications and Design Considerations......................................................... 42

4.1

Thermal Specifications ........................................................................................ 43
4.1.1

Thermal Diode ........................................................................................ 44

5.0

 S.E.C.C. and S.E.C.C.2 Mechanical Specifications ........................................................ 44

5.1

S.E.C.C. Mechnical Specifications ...................................................................... 45