Справочник Пользователя для Intel Pentium 4 M RH80532GC029512
Модели
RH80532GC029512
Package Mechanical Specifications
Mobile Intel
Pentium
4 Processor-M Datasheet
63
Table 34. Micro-FCPGA Package Dimensions
NOTES:
1. All Dimensions are subject to change. Values shown are for reference only.
2. Overall height with socket is based on design dimensions of the Micro-FCPGA package and socket with no
2. Overall height with socket is based on design dimensions of the Micro-FCPGA package and socket with no
thermal solution attached. Values were based on design specifications and tolerances. This dimension is
subject to change based on socket design, OEM motherboard design, or OEM SMT process.
subject to change based on socket design, OEM motherboard design, or OEM SMT process.
S ym bol Param eter
M in
M ax
Unit
A
Overall height, top of die to package seating plane
1.81
2.03
m m
-
Overall height, top of die to PCB surface, including socket(1)
4.69
5.15
m m
A1 Pin
length
1.95 2.11
m m
A2 Die
height
0.854
m m
A3
Pin-side capacitor height
-
1.25
m m
B Pin
diam eter
0.28 0.36
m m
D Package
substrate
length
34.9 35.1
m m
E Package
substrate
width
34.9 35.1
m m
D1 Die
length
12.24 (B0 Step)
11.62 (B0 Step Shrink
& C1/D1 Step)
m m
E1 Die
width
11.93 (B0 Step)
11.34 (B0 Step Shrink
& C1/D1 Step)
m m
e Pin
pitch
1.27
m m
K Package
edge
keep-out
5
m m
K1 Package
corner
keep-out
7
m m
K3
Pin-side capacitor boundary
14
m m
-
Pin tip radial true position
<=0.254
m m
N Pin
count
478
each
Pdie
Allowable pressure on the die for therm al solution
-
689
kPa
W Package
weight
4.5
g
Package
Surface
Flatness
0.286 m m