Справочник Пользователя для Cypress CY62126EV30
MoBL
®
, CY62126EV30
Document #: 38-05486 Rev. *E
Page 4 of 13
Thermal Resistance
Tested initially and after any design or process changes that may affect these parameters.
Parameter
Description
Test Conditions
VFBGA
Package
TSOP II
Package
Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
Still Air, soldered on a 4.25 x 1.125 inch,
two-layer printed circuit board
58.85
28.2
°C/W
Θ
JC
Thermal Resistance
(Junction to Case)
17.01
3.4
°C/W
Figure 3. AC Test Loads and Waveforms
Parameters
2.2V - 2.7V
2.7V - 3.6V
Unit
R1
16600
1103
Ohms
R2
15400
1554
Ohms
R
TH
8000
645
Ohms
V
TH
1.2
1.75
Volts
Data Retention Characteristics
Over the Operating Range
Parameter
Description
Conditions
Min
Typ
Max
Unit
V
DR
V
CC
for Data Retention
1.5
V
I
CCDR
[7]
Data Retention Current
V
CC
= V
DR
, CE > V
CC
– 0.2V,
V
IN
> V
CC
– 0.2V or V
IN
< 0.2V
Industrial
3
μA
Automotive
30
μA
t
CDR
Chip Deselect to Data
Retention Time
0
ns
t
R
Operation Recovery Time
t
RC
ns
Figure 4. Data Retention Waveform
V
CC
V
CC
OUTPUT
R2
30 pF
INCLUDING
JIG AND
SCOPE
GND
90%
10%
90%
10%
Rise Time = 1 V/ns
Fall Time = 1 V/ns
OUTPUT
V
TH
Equivalent to: THÉVENIN EQUIVALENT
ALL INPUT PULSES
R
TH
R1
V
CC(min)
V
CC(min)
t
CDR
V
DR
> 1.5V
DATA RETENTION MODE
t
R
V
CC
CE
Notes
8. Tested initially and after any design or process changes that may affect these parameters.
9. Full device AC operation requires linear V
9. Full device AC operation requires linear V
CC
ramp from V
DR
to V
CC(min)
> 100
μs.