Справочник Пользователя для Intel S5000PSL
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Server Board Overview
Intel® Server Boards S5000PSL and S5000XSL TPS
Intel
®
Xeon
®
Processor 5050
667 MHz
3.0 GHz
2x 2 MB
95
Yes
Intel
®
Xeon
®
Processor 5060
1066 MHz
3.2 GHz
2x 2 MB
130
Yes
Intel
®
Xeon
®
Processor 5063
1066 MHz
3.2 GHz
2x 2 MB
95
Yes
Intel
®
Xeon
®
Processor 5080
1066 MHz
3.73 GHz
2x 2 MB
130
Yes
Intel
®
Xeon
®
Processor 5110
1066 MHz
1.60
4 MB
65
Yes
Intel
®
Xeon
®
Processor 5120
1066 MHz
1.86
4 MB
65
Yes
Intel
®
Xeon
®
Processor 5130
1333
2.00
4 MB
65
Yes
Intel
®
Xeon
®
Processor 5140
1333
2.33
4 MB
65
Yes
Intel
®
Xeon
®
Processor 5148
1333
2.33
4 MB
40
Yes
Intel
®
Xeon
®
Processor 5150
1333
2.66
4 MB
65
Yes
Intel
®
Xeon
®
Processor 5160
1333
3.00
4 MB
80
Yes
3.1.2.1
Processor Population Rules
When two processors are installed, both must be of identical revision, core voltage, and bus/core speed. When only one processor is
installed, it must be in the socket labeled CPU1. The other socket must be empty.
installed, it must be in the socket labeled CPU1. The other socket must be empty.
The board is designed to provide up to 130A of current per processor. Processors with higher current requirements are not
supported.
supported.
No terminator is required in the second processor socket when using a single processor configuration.
3.1.2.2
Common Enabling Kit (CEK) Design Support
The server board complies with Intel’s Common Enabling Kit (CEK) processor mounting and heatsink retention solution. The server
board ships with a CEK spring snapped onto the underside of the server board, beneath each processor socket. The heatsink
attaches to the CEK, over the top of the processor and the thermal interface material (TIM). See the figure below for the stacking
order of the chassis, CEK spring, server board, TIM, and heatsink.
board ships with a CEK spring snapped onto the underside of the server board, beneath each processor socket. The heatsink
attaches to the CEK, over the top of the processor and the thermal interface material (TIM). See the figure below for the stacking
order of the chassis, CEK spring, server board, TIM, and heatsink.
The CEK spring is removable, allowing for the use of non-Intel heatsink retention solutions.
Revision
1.2
Intel order number: D41763-003
30