Справочник Пользователя для Intel S5000PSL

 

 

The server board supports the Thermal Design Point (TDP) guideline for Intel

®

 Xeon

®

 

processors. The Flexible Motherboard Guidelines (FMB) has also been followed to help 
determine the suggested thermal and current design values for anticipating future processor 
needs. The following table provides maximum values for Icc, TDP power and T

CASE

 for the dual 

core Intel

®

 Xeon

®

 processor 5000 sequence family. 

130 W 

70º C 

150 A 

 
Note: These values are for reference only. The 

Dual-Core Intel® Xeon®) processor 5000 

sequence Datasheet contains the actual specifications for the processor. If the values found in 
the 

Dual-Core Intel(r) Xeon(r) processor 5000 sequence Datasheet are different than those 

Dual-Core Intel(r) Xeon(r) processor 5000 sequence Datasheet values will 

This section is for reference purposes only. The intent is to provide guidance to system 
designers to determine a power supply for use with this server board. This section specifies the 
power supply requirements Intel used to develop a power supply for its 5U server system. 

The combined power of all outputs shall not exceed the rated output power of the power supply. 
The power supply must meet both static and dynamic voltage regulation requirements for the 
minimum loading conditions.  

+3.3 V 

1.5 A 

24 A 

 

+5 V 

1.0 A 

24 A 

 

+12 V1 

0.5 A 

16 A 

18 A 

+12 V2 

0.5 A 

16 A 

18 A 

+12 V3 

0.5 A 

14 A 

 

+12 V4 

0.5 A 

8 A 

13 A 

-12 V 

0 A 

0.5 A 

 

+5 VSB 

0.1 A 

3.0 A 

3.5 A 

1. 

Maximum continuous total DC output power should not exceed 550 W. 

2. 

Maximum continuous combined load on +3.3 VDC and +5 VDC outputs shall not exceed 140W. 

3. 

Maximum peak total DC output power should not exceed 660W. 

4. 

Peak power and current loading shall be supported for a minimum of 12 seconds. 

5. 

Maximum combined current for the 12 V outputs shall be 41 A. 

6. 

Peak current for the combined 12 V outputs shall be 50A.