Справочник Пользователя для Intel S3420GP

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Design and Environmental Specifications
 
IntelP®P Server Board S3420GP TPS
 
9.3.1 
Processor Power Support 
The server board supports the Thermal Design Power (TDP) guideline for Intel
®
 Xeon
®
 
processor. The Flexible Motherboard Guidelines (FMB) were also followed to help determine 
the suggested thermal and current design values for anticipating future processor needs. The 
following table provides maximum values for Icc, TDP power and T
CASE
 for the Intel
® 
Xeon
®
 
3400 Series processor. 
Table 56. Intel
®
 Xeon
®
 Processor TDP Guidelines 
TDP Power 
Maximum T
CASE
Icc Maximum 
95 W 
67.0º C 
150 A 
9.4 
Power Supply Output Requirements
 
This section is for reference purposes only. The intent is to provide guidance to system 
designers to determine a power supply for use with this server board. This section specifies the 
power supply requirements Intel used to develop a power supply for the Intel
® 
Server System 
SR1630GP and SR1630HGP. 
The following tables define two power and current ratings for this 350-W power supply. The 
combined output power of all outputs should not exceed the rated output power. The power 
supply must meet both static and dynamic voltage regulation requirements for the minimum 
loading conditions.  
Table 57. 350-W Load Ratings 
Voltage 
Minimum Continuous 
Maximum Continuous 
Peak 
+3.3 V 
0.2A 
14 A 
 
+5 V 
1.0 A 
18A 
 
+12 V 
1.5A 
24 A 
28A 
-12 V 
0A 
0.3A 
 
+5 VSB 
0.1 A 
2.0 A 
2.5 A 
1. Notes: 
1.  Maximum continuous total DC output power should not exceed 350 W. 
2.  Peak total DC output power should not exceed 400 W. 
3.  Peak power and peak current loading should be supported for a minimum of 12 seconds. 
4.  Combined 3.3 V/5 V power should not exceed 100 W. 
  
Revision 
1.0 
Intel order number E65697-003 
88