Справочник Пользователя для Intel S3420GP
Introduction
IntelP®P Server Board S3420GP TPS
1. Introduction
This Technical Product Specification (TPS) provides board specific information detailing the
features, functionality, and high-level architecture of the Intel
features, functionality, and high-level architecture of the Intel
®
Server Board S3420GP.
In addition, you can obtain design-level information for specific subsystems by ordering the
External Product Specifications (EPS) or External Design Specifications (EDS) for a given
subsystem. EPS and EDS documents are not publicly available and must be ordered through
your local Intel representative.
External Product Specifications (EPS) or External Design Specifications (EDS) for a given
subsystem. EPS and EDS documents are not publicly available and must be ordered through
your local Intel representative.
1.1 Chapter
Outline
This document is divided into the following chapters:
Chapter 1 – Introduction
Chapter 2 – Server Board Overview
Chapter 3 – Functional Architecture
Chapter 4 – Platform Management
Chapter 5 – BIOS User Interface
Chapter 6 – Connector / Header Locations and Pin-outs
Chapter 7 –Jumpers Blocks
Chapter 8 – Intel
®
Light-Guided Diagnostics
Chapter 9 – Design and Environmental Specifications
Chapter 10 – Regulatory and Certification Information
Appendix A – Integration and Usage Tips
Appendix B – Integrated BMC Sensor Tables
Appendix C – POST Code Diagnostic LED Decoder
Appendix D – POST Code Errors
Appendix E – Supported Intel
®
Server Chassis
1.2 Server Board Use Disclaimer
Intel Corporation server boards contain a number of high-density VLSI and power delivery
components that need adequate airflow to cool. Intel ensures through its own chassis
development and testing that when Intel server building blocks are used together, the fully
integrated system meets the intended thermal requirements of these components. It is the
responsibility of the system integrator who chooses not to use Intel developed server building
blocks to consult vendor datasheets and operating parameters to determine the amount of
airflow required for their specific application and environmental conditions. Intel Corporation
cannot be held responsible if components fail or the server board does not operate correctly
when used outside any of their published operating or non-operating limits.
components that need adequate airflow to cool. Intel ensures through its own chassis
development and testing that when Intel server building blocks are used together, the fully
integrated system meets the intended thermal requirements of these components. It is the
responsibility of the system integrator who chooses not to use Intel developed server building
blocks to consult vendor datasheets and operating parameters to determine the amount of
airflow required for their specific application and environmental conditions. Intel Corporation
cannot be held responsible if components fail or the server board does not operate correctly
when used outside any of their published operating or non-operating limits.
Revision
1.0
Intel order number E65697-003
2