Справочник Пользователя для Intel E8501

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The power simulation software is a utility designed to dissipate the thermal design power on an 
E8500/E8501 chipset NB component or XMB component when used in conjunction with the 
64-bit Intel

® 

Xeon

®

 processor MP or Dual-Core Intel

® 

Xeon

®

 processor 7000 sequence. The 

combination of the above mentioned processor and the higher bandwidth capability of the 
E8500/E8501 chipsets enable higher levels of system performance. To assess the thermal 
performance of the chipset thermal solution under “worst-case realistic application” conditions, 
Intel is developing a software utility that operates the chipset at near worst-case thermal power 
dissipation.

The power simulation software being developed should only be used to test thermal solutions at or 
near the thermal design power. 

 shows a decision flowchart for determining thermal 

solution needs. Real world applications may exceed the thermal design power limit for transient 
time periods. For power supply current requirements under these transient conditions, please refer 
to each component's datasheet for the ICC (Max Power Supply Current) specification. Contact 
your Intel field sales representative to order the power utility software and user's guide.

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